Current Projects

ITHERM 2023

Evolution of TIM/Copper Interface Under Wide Temperature Excursions

Pad Cratering Evolution With Multiple Reflows at Resin-Copper Interfaces Under Large Out-of-Plane Deformation

InterPACK 2023

Evaluating the Impact of Prolonged Storage on High Strain Rate Performance of Sac-R Solders Under Varying Operating Temperatures

Sustainable Water-Based Silver Nanoparticle Ink With Surface-Mount Component Attachment Using Aerosol Jet Printer

ITHERM 2024

Advancing Sustainability in Printed Electronics: Low-Temperature Interconnects and Water-Based Ink Performance

Reliability of Additively Printed In-Mold Electronics Using ECA in Sustained High-Temperature Operation