InterPACK 2025 Posters
-
High Temperature Reliability of Flexible Printed Circuits on Biodegradable Substrates With Water Based Inks and Room Temperature Adhesives -
Knee-Point Based Degradation Modeling and Lifetime Prognostics on Li-Ion Cells Under Sustained Thermal Stress -
Thermal Aging-Induced Degradation of Fracture Toughness in Non-PFAs Potting Materials -
Performance Evaluation of Additively Printed Multi-Layer Flexible Hybrid Electronic Circuit Tested Under Different Real-Life Loads -
Reliability Evaluation of Rectifier Circuits on Ceramic Substrates Under Wide Temperature Ranges Using SAC305 and TLPS -
Reliability of Screen-Printed In-Mold Electronics on Polycarbonate Substrates Under Thermal Cycling -
Process Study and Reliability Assessment of Seed Paper Based Additively Printed Electronics
ITherm 2025 Posters
-
Development of High Temperature Capable Semi Semi Additive Logic Gate Circuits on Copper Clad Ceramic Substrates for Automotive Applications -
Evaluation Of High Temperature Performance of Semi Additive Rectifier Circuits up to 175C -
High Temperature Operating Reliability of Direct Write Additively Printed Sustainable Flexible Circuits -
Screen Printed In Mold Electronics Reliability on Polycarbonate Substrates under Sustained High Temperature Conditions -
Seed Paper Based Sustainable Electronics with Water Based Inks and Low Temperature Processing for Additive Electronics -
Thermal Cycling Reliability of Gravure Offset Additive Electronics with Water Based Ink Biodegradable Substrate and Room Temperature Curable Adhesives -
Thermal Impedance Evolution of Non PFAS Thermal Interface Materials Under High Temperature and Humidity Exposure