AUEPRI News

Held across campus venues, including the Brown-Kopel Engineering Student Achievement Center and the Shelby Center, the summit brought together representatives from more than 30 companies and agencies across nearly a dozen states to discuss how digital engineering, modeling and simulation can help modernize the defense industrial base.
Auburn hosts Defense Industrial Base Digital Engineering Summit
Pradeep Lall displays a high-g test assembly with real-time digital image correlation measurements for training of AI reliability models.
EPRI leading AI revolution in semiconductor packaging
Pradeep Lall, director of the Auburn University Electronics Packaging Research Institute, displays additive electronics for automotive applications.
EPRI director presents on additive in-mold electronics at NAE symposium
(L-R) Tommy Battle, mayor of Huntsville; Rex Reynolds, Alabama state representative; Scott Miller, director of technology, NextFlex; Mario Eden, dean of engineering, Auburn University; Pradeep Lall, director of the Electronics Packaging Research Institute and the MacFarlane Distinguished Professor and Alumni Professor, Auburn University; Dan Gamota, executive director, NextFlex; Sam Givhan, Alabama state senator; and Steve Taylor, senior vice president for research and economic development.
Auburn to lead new NextFlex hybrid electronics node
Pradeep Lall, director of the Auburn University Electronics Packaging Research Institute, displays additive electronics for automotive applications.
Auburn to host NextFlex workshop in aerospace and automotive electronics
Research at the Electronics Packaging Research Institute (EPRI) includes aerosol-jet additive processing for manufacturing flexible electronics.
Auburn's vision for flexible electronics future aligns with CES 2025