High Strain Rate Test Setup     Experimental Test Results

 

Synopsis:

Electronic components in the automotive, oil-exploration, and military industries may be subjected to severe hot and low temperatures, as well as transient loads at high strain rates. Electronic equipment in harsh environments may undergo strain rates of 1-100 per second and temperatures ranging from extreme low to extreme high (-65 ℃ to 200 ℃). The constitutive behavior of electronic materials at minuscule length scales and high strain rates is poorly understood. New innovations in Pb-free solders have included minor quantities of Ni, Zn, Co, Bi, and Sb into SAC alloys to boost resistance to aging and creep while retaining melting temperature and alloy strength. Understanding operating temperature and long-term aging mechanical behavior is required to design and forecast the life of an electronic device. The lack of adequate material data reduces the predicted accuracy of computational models for the transient dynamics of electronics subjected to shock and vibration. Materials under consideration include lead-free solders, low-k dielectrics, under-fills, thin-film adhesives, fine-pitch copper traces, and conformal coatings.

Test Vehicle for Drop-Shock Analysis     FEA results for Drop-Shock Events

Related Recent Publications:

  1. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging." ASME. J. Electron. Packag. September 2024; 146(3): 031006. https://doi.org/10.1115/1.4064521.
  2. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "High-G Level Shock Damage-Accrual in Doped/Undoped SnAgCu Solders Under 100°C Sustained Operation Up to 1-Year." Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Diego, California, USA. October 24–26, 2023. V001T08A008. ASME. https://doi.org/10.1115/IPACK2023-111981.
  3. Lall, P., Mehta, V., Suhling, J., and Locker, D., “Study of Sustained High-Temperature on the Reliability of Lead-Free Solder Joint Assemblies under Vibration”, Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Diego, California, USA. October 24–26, 2023. V001T08A009. ASME. https://doi.org/10.1115/IPACK2023-111984.
  4. Lall, P., Mehta, V., Saha, M., “Effect of Bi-Addition on the High Strain Rate Properties of SnAgCu Solders under Wide Temperature Extremes and Prolonged Exposure to High Temperature”, Surface Mount Technology Association International Conference & Exposition (SMTA-2023), pp. 206-214, October 09–12, 2023.
  5. Lall, P., Saha, M., Suhling, J., and Locker, D., "Assessment of Effect of Operating Temperature on SAC-R Solders at High Strain Rates After Prolonged Storage." Proceedings of the ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. San Diego, California, USA. October 24–26, 2023. V001T08A011. ASME. https://doi.org/10.1115/IPACK2023-112036
  6. Lall, P., Mehta, V., Yadav, V., Saha, M., Suhling, J., "Evolution of Propensity for High Strain-Rate Damage Accrual in Doped and Undoped SnAgCu Lead-free Solders in Temperature Range of -65°C to +200°C after 1-Year Sustained High Temperatures Exposure," 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), Orlando, FL, USA, 2023, pp. 1072-1079, doi: 10.1109/ECTC51909.2023.00183.
  7. Lall, P., Mehta, V., Yadav, V., Saha, M., Suhling, J., "Undoped and Doped Solder Performance under High Strain Rates and Wide Operating Temperatures after Prolonged Storage," 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Graz, Austria, 2023, pp. 1-8, doi: 10.1109/EuroSimE56861.2023.10100788.
  8. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C." Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Garden Grove, California, USA. October 25–27, 2022. V001T10A010. ASME. https://doi.org/10.1115/IPACK2022-97438.
  9. Lall, P., Saha, M., Suhling, J., and Blecker, K., "Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days." Proceedings of the ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Garden Grove, California, USA. October 25–27, 2022. V001T10A013. ASME.
  10. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures after Exposure to Isothermal Aging Up to 90 Days." ASME. J. Electron. Packag. June 2022; 144(2): 021108. https://doi.org/10.1115/1.4052073.
  11. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "Effect of Evolution of High Strain Rate Properties on Plastic-Work of SAC305 Alloy with 100°C Aging for Periods up to 240-days," 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2022, pp. 1-16, doi: 10.1109/iTherm54085.2022.9899641.
  12. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "High Strain Rate Mechanical Properties of M758 Solder at Extreme Surrounding Temperatures, with 100°C Isothermal Aging for up to 180 Days," 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2022, pp. 1-15, doi: 10.1109/iTherm54085.2022.9899630.
  13. Lall, P., Mehta, V., Yadav, V., Saha, M., Suhling, J., and Locker, D., "Extreme Low-Temperature High Strain-Rate Constitutive Behavior Evolution of Doped and Undoped Leadfree Solders under Sustained High Temperature Exposure," 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2022, pp. 1646-1657, doi: 10.1109/ECTC51906.2022.00261.
  14. Lall, P., Saha, M., and Suhling, J., "Effect of Prolonged Storage on High strain rate Mechanical properties of QSAC10 and QSAC20 Solders after Exposure to Isothermal Aging of 50°C," 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2022, pp. 1-10, doi: 10.1109/iTherm54085.2022.9899674.
  15. Lall, P., Saha, M., Suhling, J., and Blecker, K., "Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C," 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2022, pp. 1-12, doi: 10.1109/iTherm54085.2022.9899576.
  16. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging." Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Virtual, Online. October 26–28, 2021. V001T07A020. ASME. https://doi.org/10.1115/IPACK2021-74067
  17. Lall, P., Saha, M., Suhling, J., and Blecker, K., "Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R after Exposure to Isothermal Aging of 50°C Up To 8 Months." Proceedings of the ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. Virtual, Online. October 26–28, 2021. V001T07A022. ASME. https://doi.org/10.1115/IPACK2021-74069
  18. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "High Strain Rate Properties of M758 Solder at Extreme Operating Temperatures," 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2021, pp. 740-750, doi: 10.1109/ITherm51669.2021.9503217.
  19. Lall, P., Mehta, V., Suhling, J., and Blecker, K., "High Strain Rate Properties of SAC305 Alloy at Cold Temperatures Subsequent to 100°C Storage for Periods up to 120 Days," 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2021, pp. 729-739, doi: 10.1109/ITherm51669.2021.9503219.
  20. Lall, P., Yadav, V., Mehta, V., Suhling, J., and Locker, D., "Low-Temperature High Strain Rate Constitutive Behavior of Doped and Undoped SnAgCu Solder Alloys after Prolonged Storage at High Temperature," 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 2021, pp. 830-841, doi: 10.1109/ECTC32696.2021.00142.
  21. Lall, P., Yadav, V., Mehta, V., Suhling, J., and Locker, D., "High Temperature High Strain Rate Properties of SAC305 with Effect of 100°C Storage for Prolonged Duration," 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2021, pp. 981-990, doi: 10.1109/ITherm51669.2021.9503135.
  22. Lall, P., Saha, M., and Suhling, J., "Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for QSAC10 and QSAC20," 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), San Diego, CA, USA, 2021, pp. 885-892, doi: 10.1109/ITherm51669.2021.9503304.