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3DIC SoC Test Benchmarks (Compatibility)

3DSIC SOC Test Benchmarks (Compatibility)

 

Since the focus of many studies is not on hardware constraints, these benchmarks come with a sample compatibility graph so researchers can spend more time on their specific problem. Each die of each benchmark comes with a compatibility file, where each line defines the the compatibility between non-embedded modules. The entry per line is a given module, and future entries are all modules which the given module is compatible with. For example...

3 1 3 8

..States that module M3 is compatible with M1, M3 (a module will always be compatible with itself), and M8. Compatibility is not defined between dies, and it is presumed that dies are universally compatible. Also, compatibility for embedded modules is not defined, and it is presumed that only one embedded module for any given module can be tested at any one time, and embedded modules share compatibility between other non-embedded modules with their master module.

The example compatibility files provided by no means need to followed. Any study is free to create their own hardware compatibility method to suit their study.

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Last Updated: Nov 10, 2021
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