Quantum Computing <101|
Abstract:
Conventional CMOS-based, von Neumann architecture, classical computing technologies are reaching their limits due to power and memory constraints. Multiple non-von Neumann (nvN) architectures (neuromorphic, analog, cellular, etc.) are currently being explored for heterogenous computing. One key type of nvN computing is quantum computing, which is a form of quantum information processing and uses quantum properties of quantum computing elements (quantum bits, or qubits) such as superposition and entanglement. These key quantum properties, which are not found in classical bits, can be used advantageously in quantum computers to allow them to (hopefully!) outperform classical computers at certain tasks. In this talk, I’ll describe some needed low-level quantum mechanics, discuss some implications of using qubits, try to dispel some myths of quantum computing (they’re not just for breaking encryption!) and discuss some recent quantum computing hardware.
Bio:
Dr. Michael C. Hamilton obtained his B.S.E.E. from Auburn University in 2000 and M.S.E.E. and Ph.D. from The University of Michigan in 2003 and 2005, respectively. His graduate work focused on organic semiconductor-based transistors and sensors. From 2006 to 2010, he was at MIT-Lincoln Laboratory (Lexington, MA), where he worked on projects related to next generation geostationary weather satellite systems, highly-scaled and environmentally-optimized CMOS devices subjected to extreme environmental conditions (for example, cryo), and high-frequency / RF circuits based on fully-depleted silicon-on-insulator (FD-SOI) transistors and CCD structures. Dr. Hamilton joined the Electrical and Computer Engineering Department of Auburn University as an Assistant Professor in 2010 and was promoted to Associate Professor in 2015. He became the Director of the Alabama Micro/Nano Science and Technology Center in 2016. His current interests and areas of research include: packaging and integration of dense high-speed/high-power systems, signal and power integrity of advanced integrated systems, application of micro and nanostructures for enhanced performance of RF and microwave systems, packaging for extreme environments (both high and low temperature) and superconducting electronics technologies.
