This laboratory includes a state-of-the-art high volume surface mount assembly line capable of flip chip assembly, as well as other equipment for advanced electronics packaging including manual and automated wire bonders, encapsulant dispense systems, facilities for thick/thin film hybrid circuit fabrication on ceramic substrates, and a vacuum solder sealing system for MEMS and SiC packaging. The surface mount assembly line can be used for prototype creation, fabrication of test structures, development of manufacturing processes or new product launch platform. In addition, in-line inspection capabilities enable x-ray, acoustic and laser profilometry based inspections. In addition, the laboratory has semi-automatic placement machines and rework stations. Specific equipment includes, MPM AP Solder Paste Printer with Vision System, Agilent SP1 Solder Paste Inspection System, Asymtek Flux Jetting System, Siemens SIPLACE 80F5 Pick and Place Machine, VISCOM VPS 6053 Automated Optical Inspection System, Heller 1800 Solder Reflow Conveyer Oven with Nitrogen Capability, Slim-KIC 2000 Thermal Profiling System, CAM/ALOT 3700 Encapsulant Dispense System.
Electronic Packaging
Air Vac DRS24 Solder Rework Station, Semiconductor Equipment Corporation 4150 Split Optics Alignment System for Die Placement, Karl Suss Thermocompression Flip Chip Bonder, Yield Engineering YES-R3 Plasma Etch System, Palomar Products Model 2460-V Automatic Thermosonic Wire Bonder, K & S Model 2071 VFP Automatic Wedge Bonder, Asymtek Model 402 Dispensing System, Fisher Scientific Programmable Cure Oven, ATV Model PEO 601 Programmable Brazing Furnace, SST 3150 Vacuum Sealing Furnace. The assembly and packaging resources are supported by inspection and failure analysis equipment including a Phoenix micro-focus x-ray system, Sonix C-mode scanning acoustic microscopy (CSAM) system, WYCO wafer inspection system, Tencor surface profilometer, Brookfield viscometer, Dage PC2400 pull and shear tester, and optical and scanning electron microscopes.