Synopsis:
The decapsulation system removes an integrated circuit encapsulated in a mold compound using a user-specified chemical solution. The results of this process can be used in several ways but are most seen in semiconductor failure analysis and counterfeit protection during the verification process. Decapsulation facilitates the inspection of the die, interconnects, and other features typically examined during failure analysis. This can be done in various devices such as board-mounted devices, ceramics, bonded or flip-chip applications, stacked die devices, etc. This system can safely etch almost any sample placed in its etch chamber. This versatile system can be fine-tuned to handle even the most complex package designs, including those with gold, aluminum, and copper wires