Journal Articles

ARTGroup publications can be found in this Google Scholar.
2024-2025  
  • M. Azarifar and M. Arik, "Liquid synthetic jets for high flux electronics cooling", Applied Thermal Engineering, February 2025.
  • M. Azarifar, F. Ahmed, and M. Arik, "Vortex-enhanced jet impingement and the role of impulse generation rate in heat removal using additively manufactured synthetic jet devices", Applied Thermal Engineering, January 2025.
  • T. Emir, M. Budakli, and M. Arik, “Pool boiling heat transfer: Thermal performance for alternating and extended operational conditions”, International Journal of Heat and Mass Transfer, July 2024.
  • M. Azarifar, M. Arik, and J. Chang, “Liquid cooling of data centers: A necessity facing challenges”, Applied Thermal Engineering, June 2024.  
2022-2023  
  • A. Saygin, A. M. Basol and M. Arik, “An Eulerian multiphase frost model based on heat transfer measurements”, International Journal of Heat and Mass Transfer, December 2023.  
  • A. Saygin, A. M. Basol and M. Arik, “An Experimental Study on the Frost Formation over a Flat Plate: Effect of Frosting on Heat Transfer”, Experimental Thermal and Fluid Science, January 2023.  
  • M. Azarifar, M. Arik, Bin Xie, and X. Luo, “Effect of Phase Change Materials on the Optical Path of LEDs for Opto-Thermal Enhancement”, IEEE Journal of Electron Devices, accepted for publication, March 2023.  
  • C. Cengiz, A. M. Muslu, M. Azarifar, M. Arik, and B. Dogruoz, "Discrete Phase Analysis of Self Heating Particles Over An Immersion Liquid Cooled High Power Blue LED with Suspended Phosphor Particles," ASME Journal of Heat Transfer, June 2022.  
  • M. Azarifar, K. Ocaksonmez, C. Cengiz, R. Aydoğan, and M. Arik, “Machine Learning to Predict Junction Temperature Based on Optical Characteristics in Solid State Lighting Devices: A Test on WLEDs”, Micromachines, July 2022.  
  • C. Cengiz, M. Azarifar and M. Arik, "A Critical Review on the Junction Temperature Measurement of Light Emitting Diodes", Micromachines, April 2022.  
  • M. Azarifar, C. Cengiz and M.Arik, “Dynamic opto-electro-thermal characterization of solid state lighting devices: measuring the power conversion efficiency at high current densities”, Journal of Physics D: Applied Physics, June 2022.  
  • M. Azarifar, C. Cengiz, and M. Arik, “Thermal and optical performance characterization of bare and phosphor converted LEDs through package level immersion cooling”, Int. J. Heat Mass Transfer, Vol. 189, p. 122607, 2022.  
  • T. Emir, H. Ourabi, M. Budakli, and M. Arik, “Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review”, ASME Journal of Electronics Packaging, April 2022.
2020-2021  
  • M. Azarifar, C. Cengiz, and M. Arik, “Optical and Thermal Analysis of Secondary Optics in Light Emitting Diodes’ Packaging: Analysis of MR16 Lamp”, Journal of Physics: Conference Series, September 2021.  
  • M. Ikhlaq, M. Yasir, O. Ghaffari, and M. Arik, “Acoustics and heat transfer characteristics of piezoelectric driven central orifice synthetic jet actuators”, Experimental Heat Transfer, 2022.  
  • M. Azarifar, C. Cengiz, and M. Arik, “A Roadmap for Dynamic Temperature Sensitivity Measurement of Solid State Lighting Devices: A Thermal Perspective on the Power Conversion Efficiency of Blue LEDs and Lasers” Journal of Physics, under review, February 2022.  
  • M. Azarifar, M. Budakli, A. M. Basol, and M. Arik, “On the Individual Droplet Growth Modeling and Heat Transfer Analysis in Dropwise Condensation for Advanced Heat Spreaders”, IEEE Transactions on Components, Packaging and Manufacturing Technology, July 2021.   
  • M. Azarifar, C. Cengiz, and M. Arik, “Package Level Thermal Analysis of White Light-emitting Diodes Based on Local Phosphor Particle Opto-thermal Behavior,” LED professional Review (LpR), no. 85/May-June, pp. 60–65, 2021.  
  • M. Ikhlaq, M. Yasir, M. Demiroglu, and M. Arik, “Impingement Heat Transfer Characteristics of Recent Developments in Synthetic Jet Cooling Technology for Electronics Thermal Management”, IEEE Trans. CPMT, June 2021.  
  • M. Azarifar, C. Cengiz, and M. Arik, “Particle Based Investigation of Self-Heating Effect of Phosphor in Phosphor Converted Light Emitting Diodes”, Journal of Luminescence, Vol. 231, March 2021.  
  • A. Cetiner, B. Evren, M. Budakli, A. Ozbek, and M. Arik, "Spreading Behavior of Droplets Impacting over Substrates with Varying Surface Topographies", Colloids and Surfaces A: Physicochemical and Engineering Aspects, December 2020.  
  • M. Budakli, T. K. Salem, M. Arik, B. Donmez, and Y. Menceloglu, “An Experimental Study on the Heat Transfer and Wettability Characteristics of Micro-structured Surfaces During Water Vapor Condensation Under Different Pressure Conditions”, Int. Communications in Heat and Mass Transfer, January 2021.  
  • M. Budaklı, T. K. Salem, M. Arik, B. Donmez, Y. Menceloglu, “Effect of Polymer Coating on Condensation Heat Transfer”, ASME Journal of Heat Transfer, 142(4): 041602, April 2020.  
  • M. Ikhlaq, M. Yasir, O. Ghaffari, and M. Arik, “Acoustics and Heat Transfer Characteristics of Piezoelectric Driven Central Orifice Synthetic Jet Actuators”, Experimental Heat Transfer, June 2021.  
  • M. Ikhlaq, M. Arik, A. Arshad, M. Jabbal, “Flow and Heat Transfer Characteristics of Piezoelectric-Driven Synthetic Jet Actuator with Respect to Their Stroke Length”, Advances in Heat Transfer and Thermal Engineering, pp 659-662, June 2021.  
  • M. Yildirim, P. Sendur, A. Kansizoglu, U. Uras, O. Bilgin, G. Yapici, M. Arik, and B. Ugurlu, “Design and Development of a Durable Series Elastic Actuator with an Optimized Spring Topology”, Proc. of the iMeche, Part C: Journal of Mechanical Engineering Science, June 2021.  
  • M. Budakli, T. K. Salem, and M. Arik, “An Experimental and Theoretical Analysis of Vapor-to-Liquid Phase Change on Micro-Structured Surfaces”, Applied Thermal Engineering, May 2020.  
  • A. M. Muslu, B. Ozluk, and M. Arik, "A Comparative Study on the Impact of Junction Temperature over Thermal, Optical and Electrical Traits of High Power Red Light Emitting Diodes (LEDs)", ASME Journal of Electronics Packaging (JEP), EP-19-1020, May 2020.  
2018-2019  
  • B. Ozluk, A. M. Muslu, and M. Arik, "A Comparative Study for the Junction Temperature of Green Light Emitting Diodes (LED)s", IEEE Transactions on Components, Packaging and Manufacturing Technology, TCPMT-2018-405, July 2019. 
  • T. K. Salem, M. Budaklı, O. Sahan and M. Arik, “An Experimental and Analytical Study on the Influence of Superhydrophobic Micro-Textured Surfaces on Liquid Wetting Phenomena”, Colloids and Surfaces A: Physicochemical and Engineering Aspects, Vol. 555, October 2018.  
  • T. K. Salem, I. T. Nazzal, M. Arik and M. Budakli, “Impact of Functional Nanofluid Coolant on Radiator Performance”, ASME Journal of Thermal Science and Engineering Applications, Vol. 11, Issue 4, DOI: 10.1115/1.4044271, July 2019.  
  • F. Khosroshahi and M. Arik, “Conduction Driven Cooling of LED Based Automotive LED Lighting Systems for Abating Local Hot Spots”, Optical Engineering, March 2018.  
  • H. I. Kahvecioglu, E. Tamdogan and M. Arik, “Investigation of Combined Optical and Thermal Effects on Phosphor Converted Light Emitting Diodes with Liquid Immersion Cooling”, SPIE Optical Engineering , May 2018.  
  • E. Tamdogan, G. Pavlidis, S. Graham, and M. Arik, “A Comparative Study on the Junction Temperature Measurements of LEDs with Raman Spectroscopy, Micro-Infrared (IR) Imaging and Forward Voltage Methods”, ASME Journal of Electronic Packaging, February 2018.  
2016-2017  
  • U. Uras and M. Arik, “Thermal Issues Posed by Compact Packaging and IoT for Next Generation SSL”, LED Professional Review, 64, pp. 44-51, December 2017.  
  • T. K. Salem, F. Khosroshahi, M. Arik, M. Hamdan, and M. Budakli, “Numerical and Experimental Analysis of a Heat Pipe Embedded Printed Circuit Board for Solid State Lighting Applications”, Experimental Heat Transfer, pages 1-13, November 2017.  
  • U. Z. Uras, M. Arık and E. Tamdoğan, “Thermal Performance of a Light Emitting Diode Light Engine for A Multipurpose Automotive Exterior Lighting System With Competing Board Technologies”, ASME Journal of Electronic Packaging, June 2017.  
  • S. U. Yuruker, E. Tamdogan, and M. Arik, “An Experimental and Computational Study on Efficiency of White LED Packages with a Thermo-caloric Approach”,  IEEE Transactions on Components, Packaging and Manufacturing Technology , Volume: 7, Issue: 2, Feb. 2017.  
  • S.A. Solovitz, O. Ghaffari, and M. Arik, “Frequency-dependent flow response of a high-speed rectangular synthetic jet”, Journal of Flow Visualization and Image Processing, Vol. 23, issue 1-2, January 2016.  
  • O. Ghaffari, S.A. Solovitz, M. Ikhlaq, and M. Arik, “An Investigation into Flow and Heat Transfer of an Ultrasonic Micro-blower Device for Electronics Cooling Applications” Journal of Applied Thermal Engineering, 106 (2016) 881–889, June 2016.  
  • O. Ghaffari, S.A. Solovitz, and M. Arik, “An Investigation into Flow and Heat Transfer for a Slot Impinging Synthetic Jet” Int. Journal of Heat and Mass Transfer, 100 (2016) 634–645, June 2016.  
  • M. Ikhlaq, O. Ghaffari and M. Arik, “Predicting heat transfer for low and high frequency central orifice synthetic jets”, IEEE Transactions on Components and Packaging Technologies, pp.882-888, 27-30 May 2016.  
2014-2015  
  • M. Arik and Y. Utturkar, “A computational and experimental investigation of synthetic jets for cooling of electronics”, ASME Journal of Electronic Packaging, Vol. 137, Issue. 2, June 2015.  
  • X. He, J. Lustbader, M. Arik, and R. Sharma, “Heat transfer characteristics of impinging steady and synthetic jets over vertical flat surface”, International Journal of Heat and Mass Transfer, Vol. 80, pp. 825-834, Jan. 2015.  
  • O. Ghaffari, M. Ikhlaq, and M. Arik, “Heat Transfer performance of Semi confined circular and unconfined Slot impinging synthetic jet piezoelectric actuator for small jet to surface spacing”, International Journal of Air-Conditioning and Refrigeration, Vol. 23, Issue 03, April 2014.  
  • E. Tamdogan and M. Arik, “Natural convection immersion cooling and optical degradation of liquid cooled LED systems”, ASME Journal of Electronics Packaging, Vol. 137, Issue 4, October 2015.  
  • Ri Li, William D. Gerstler, M. Arik, and Benjamin Vanderploeg, “An experimental and theoretical study for impact of synthetic jets for air-cooled arrays of fins”, Journal of Heat Transfer-Transactions of the ASME, Vol. 138, Issue 2, October 2015.  
  • M. N. Inan and M. Arik, “A multi-functional-design approach and of figure of merits for LED lighting systems”, Journal of Solid State Lighting, Vol.1, Issue.8, 27 May 2014.  
2011-2013
  • M. Arik, R. Sharma, J. Lustbader, X. He, “Steady and unsteady air impingement heat transfer for electronics cooling applications”, Journal of Heat Transfer-Transactions of the ASME, Vol. 135, Issue. 11, 23 September 2013.  
  • M. Arik and T. Icoz, “Predicting heat transfer from unsteady synthetic jets”, Journal of Heat Transfer-Transactions of the ASME, Vol. 134, Issue. 8, 31 May 2012.  
  • S. Solovitz and M. Arik, “System-level metrics for thermal management technology”, Journal of Thermal Science, Vol. 3, Issue.3, 12 August 2011.  
  • C. Seeley, Y. Utturkar, M. Arik, and T. Icoz, “Fluid structure interaction model for low frequency synthetic jets”, AIAA Journal, Vol. 49, Issue. 2, pp. 316-323, February 2011.
2009-2010
  • M. Arik, J. Jackson, S. Prabhakaran, C. Seeley, R. Sharma, Y. Utturkar, S. Weaver, G. Kuenzler, and B. Han, “Development of a high lumen solid state down light application”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 4, pp. 668-679, 22 November 2010.  
  • B. Song, B. Han, A. Bar-Cohen, R. Sharma, and M. Arik, “Hierarchical life prediction model for actively cooled LED-based luminaire”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 4, pp. 728-737, 16 August 2010.  
  • M. Arik and A. Bar-Cohen, “Pool boiling of perfluorocarbon mixtures on silicon surfaces”, International Journal of Heat and Mass Transfer, Vol. 53, Issues 23-24, pp. 5596-5604, November 2010.  
  • M. B. Dogruoz, and M. Arik, “On the conduction and convection heat transfer from lightweight advanced heat sinks”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 2, pp. 424-431, 26 April 2010.  
  • T. Icoz, and M. Arik, “Light weight high performance thermal management with advanced heat sinks and extended surfaces”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 1, pp. 161-166, 13 October 2009.  
  • J. Petroski, M. Arik and M. Gursoy, “Optimization of piezoelectric oscillating fan cooled heat sinks for electronics cooling applications”, IEEE Transactions on Components and Packaging Technologies, Vol. 33, Issue. 1, pp. 25-31, 13 October 2009.  
  • M. Arik, J. Bray, and S. Weaver, “Solid State Thermotunneling systems for power generation”, Nanoscience and Nanotechnology Letters, Vol. 2, N0.2, pp. 63-195, June 2010.  
  • M. Arik and A. Setlur, “Environmental and economical impact of LED lighting systems and effect of thermal management”, International Journal of Energy Research, Vol. 34, Issue. 13, pp. 1195-1204, 25 October 2010.  
2006-2008  
  • M. Arik, “Local heat transfer coefficients of a high frequency synthetic jets during impingement cooling over flat surfaces”, Heat Transfer Engineering, Vol. 29, Issue. 9, 2008.  
  • Y. Utturkar, M. Arik, C.E. Seeley, and M. Gursoy, “An experimental and computational heat transfer study of pulsating jets”, Journal of Heat Transfer-Transactions of the ASME, Vol. 130, Issue. 6, 23 April 2008.  
  • M. Arik, “An investigation into feasibility of impingement heat transfer and acoustic abatement of meso scale synthetic jets”, Applied Thermal Engineering, Vol. 27, Issue. 8-9, Pages 1483-1494, June 2007.  
  • M. Arik, S. Weaver, A. Setlur, D. Haitko, and J. Petroski, “Chip to system levels thermal needs and alternative thermal technologies for high brightness LEDS”, Journal of Electronic Packaging, Vol. 129, Pages 328-338, 9 April 2007.  
  • M. Arik, A. Bar-Cohen, and S.M. You, “Enhancement of pool boiling critical heat flux in dielectric liquids by micro porous coatings”, International Journal of Heat and Mass Transfer, Vol. 50, pp. 997-1009, March 2007.  
  • Bar-Cohen, M. Arik, and M. Ohadi, “Direct liquid cooling of high flux micro and nano electronic components”, Proceedings of the IEEE, Vol. 94, Issue. 8, pp. 1549-1570, August 2006.  
2004-2005
  • M. Arik and S. Weaver, “Effect of chip and bonding defects on the high brightness LED junction temperatures”, Optical Engineering, Vol. 44, Issue. 11, November 2005.  
  • M. Arik and R.S. Bunker, “Electronics packaging cooling: Technologies from gas turbine engine cooling”, Journal of Electronic Packaging, Vol. 128, Issue. 3, pp. 215-225, 16 June 2005.  
  • J. Garg, M. Arik, S. Weaver, T. Wetzel, and S. Saddoughi, “Advanced localized air cooling with synthetic jets”, ASME Journal of Electronics Packaging, Vol. 127, pp.503-511, 2005.  
  • M. Arik, S.M. Zurn, and A. Bar-Cohen, “Design and fabrication of MEMS micropumps for high heat flux electronics cooling applications”, Smart Materials and Structures, Vol. 14, pp. 1239-1249, 2005.  
  • M. Arik, J. Garg, and A. Bar-Cohen, “Thermal modeling and performance of high heat flux for SOP packages”, IEEE Transactions on Advanced Packaging, Vol. 27, Issue. 2, pp. 398-412, May 2004.  
1996-2003
  • M. Arik, and A, Bar-Cohen, “Effusivity-based correlation of surface property effects in pool boiling CHF of dielectric liquids”, International Journal of Heat and Mass Transfer, Vol. 46, Issue. 20, pp. 3755-3764, September 2003.
  • S. M. Zurn, M.T. Hsieh, G. Smith, D. Markus, G. Hughes, Y. Nam, M. Arik, and D.L. Polla, “Design and structural characterization of a resonant frequency PZT micro-cantilever”, Smart Materials and Structures, Vol. 10, No. 2, April 2001.  
  • M Arik, SM Zurn, A Bar-Cohen, Y Nam, D Markus, D Polla, "Development of CAD Model for MEMS Micropumps", Modeling and Simulation of Microelectromechnical Systems, 651-4, 1999.
  • M. Arik, C.A.C. Santos, S. Kakac, “Turbulent forced convection with sinusoidal variation of inlet temperature between two parallel-plates”, International Communications in Heat and Mass Transfer, Vol. 23, Issue. 8, Pages 1121-1132, December 1996.
  • M. Arik, C.A.C. Santos, S. Kakaç, "Turbulent forced convection with sinusoidal variation of inlet temperature between two parallel-plates", International Communications in Heat and Mass Transfer, Volume 23, Issue 8, 1996.