Conference Proceedings

ARTGroup publications can be found in this Google Scholar.

2024

• Md. S. Islam  and M. Arik, “Thermal and optical analysis of a light engine with multi color and ultraviolet light emitting diodes”, ASME 2024 International Mechanical Engineering Congress and Exposition- IMECE2024, November 17-21, 2024, Portland, Oregon.
• K. Demirhan, A. Abdusoglu, S. Hosseini, A. M. Basol, M. Arik, and E. Mirkoohi, “EXPERIMENTAL AND NUMERICAL ANALYSIS OF FROST FORMATION over a flat ADDITIVE MANUFACTURED SURFACE, ASME 2024 International Mechanical Engineering Congress and Exposition- IMECE2024, November 17-21, 2024, Portland, Oregon.
• Abdusoglu, K. Demirhan, A. M. Basol, M. Arik, “Numerical Analysis of Frost Formation on Electric Vehicle Heat Pump”, 11th International Automotive Technologies Congress, OTEKON 2024, September 9-10, 2024.
• B. Polat, M. Budakli, and M. Arik, “Dropwise Condensation of Saturated Vapor on Super-dewetting Surfaces Fabricated Through Novel Coating Approach”, 10th World Conference on Experimental Heat Transfer, Fluid Mechanics and Thermodynamics, Rhodes Island, Greece, 26-30 August 2024.
• M. Azarifar, F. Ahmed, M. Ikhlaq, and M. Arik, “Fluid Dynamic Based Modelling of Synthetic Jets for Targeted Heat Transfer Enhancement in Immersion Liquid Cooling Systems”, ITHERM 2024, Denver, CO, June 2024.
• F. Ahmed, M. Azarifar, M. Ikhlaq and M. Arik, “Comparison of Single and Dual Orifice Synthetic Jets for Flow Structure and Heat Transfer”, ITHERM 2024, Denver, CO, June 2024.
• A Abdusoglu, K Demirhan, A Saygin, AM Basol, and M. Arik, “NUMERICAL ANALYSIS OF FROST FORMATION ON FINNED TUBE HEAT EXCHANGERS”, Proceedings of the 9th CHT-24 ICHMT International Symposium on Advances in Computational Heat Transfer, Istanbul, Turkey, May 26-30, 2024.

2022-2023

• A. Saygin, A. M. Basol, and M. Arik, “An Experimental Study Over Frost Formation: Transient Heat Transfer Analysis via Dimensionless Numbers”, 8th Thermal and Fluids Engineering Conference (TFEC), College Park, MD, March 2023.  
• T. Emir, M. Budakli, M. Paul, M. Arik, and N. Shamsaei, “EFFECT OF ADDITIVE MANUFACTURED MICROCHANNELS OVER POOL HEAT TRANSFER IN A DIELECTRIC LIQUID”, Pro. of the 17th International Heat Transfer Conference, IHTC-17, August 2023, Cape Town, South Africa.  
• M. Azarifar and M. Arik, “Direct Numerical Simulation of Synthetic Jet Coupled to Forced Convection Cooling in a Channel Flow”, IEEE Itherm Conference, Orlando, FL, May 2023.  
• M. Budakli and M. Arik, “Saturated and Superheated Water Vapor Condensation on a Custom Micro-Textured Surface”, IEEE Itherm Conference, Orlando, FL, May 2023.  
• T. Emir, M. Budaklı and M. Arik, “M. Budakli and M. Arik, “Impact of Oxidation on Pool Boiling Heat Transfer Performance over Flat Plates Exposed to Extended Operating Conditions”, IEEE Itherm Conference, Orlando, FL, May 2023.  
• M. Azarifar, C. Cengiz, K. Ocaksonmez, A. Onal, S. Nizamoglu, and M. Arik, “High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering”, ASME Interpack, Los Angeles, October 2022.  
• T. Emir, Y. G. Yazici, M. Budakli, and M. Arik, “Pool boiling heat transfer in dielectric fluids and impact of surfaces on the repeatability”, ASME Interpack Conference, October 2022.  
• A. Saygin, E.A. Oksuz, A. M. Basol, and M. Arik, “Analysis of Frost Formation Under Natural Convection Conditions over a Vertical Plate”, International Mechanical Engineering Congress & Exposition (SHTC), June 2022, Philadelphia, USA.  
• A. Saygin, C. Topal, A. M. Basol, M. Arik “Influence of Frost Formation on Heat Transfer Effectiveness of Extended Surfaces”, Proceedings of CONV-22: Int. Symp. on Convective Heat and Mass Transfer, Izmir, Turkey, June 5-10, 2022.  
• T. Emir, M. Budakli, and M. Arik, “Effect of Subcooling and Pressure over Nucleate Pool Boiling on Micro-drilled Surfaces”, Proceedings of CONV-22: Int. Symp. on Convective Heat and Mass Transfer, Izmir, Turkey, June 5-10, 2022.  

2020-2021

• M. Azarifar, and M. Arik, “Heat and Mass Transfer Analysis of Individual Droplet on Superhydrophobic Surface and Surrounding Vapor During Dropwise Condensation”, ATE-HEFAT, July 2021.   
• C. Cengiz, M.Azarifar, and M. Arik, " Thermal and Optical Characterization of White and Blue Multi-Chip LED Light Engines”, 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 2021.  
• M. Azarifar, C. Cengiz, and M. Arik, “Optical and Thermal Analysis of Secondary Optics in Light Emitting Diode’s Packaging: Analysis of MR16 Lamp”, 2021 8th European Thermal Sciences Conference (EUROTHERM), September 2021, Lisbon, Portugal.  
• A. Saygin, E. A. Oksuz, A. M. Basol, and M. Arik, “A Numerical Investigation into Frost Formation under Impinging Flow Conditions”, IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), June 2021.  

• E. A. Oksuz and M. Arik, “Investigation of frost formation during impinging air flow on finned aluminium substrates”, TIBTD ULIBTK2021 Conference, September 2021, Gaziantep, Turkey.  
• A. Saygin, E. A. Oksuz, A. M. Basol, and M. Arik, "Analysis of Frost Formation Under Natural Convection Conditions over a Vertical Plate", International Mechanical Engineering Congress & Exposition (IMECE), November 2021.   
• C. Cengiz, A. Muslu, M. Arik, and B. Dogruoz, "Enhanced Thermal Performance of High Flux LED Systems with Two-Phase Immersion Cooling", Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), 19th IEEE Intersociety Conference, June 2020.  
• E. A. Oksuz, A. Saygin, A. M. Basol, M. Budakli, and M. Arik, An Experimental Investigation Into Frost Accumulation Over Vertical Finned and Unfinned Surfaces During Impinging Air Flow”, ASME Interpack Conference, October 2020, San Francisco, USA.  
• G. Tarcin, A. Saygin, M. Muslu, M. Busakli, and M. Arik, “Rapid Heating And Cooling Chamber for a Photonics Junction Measurement System”, 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems Itherm, July 2020.  

2018-2019

• A. Muslu, and M. Arik, “Challenges for Measuring Multichip LED Light Engines for Interior Lighting Applications”, Lighting Professional Symposium (LPS) 2019, Bregenz, September 23-27, 2019.  
• A. Muslu, and M. Arik, “Measuring Junction Temperature of LEDs:  
  Challenges and Opportunities”, ASME Interpack Conference, October 7-9, 2019.  
• A. Muslu, and M. Arik, “Impact of Electronics over Localized Hot Spots over Multi-Chip White LED Light Engines”, IEEE Itherm Conference 2019, June 2019.  
• A. Cetiner, B. Evren, M. Budaklı, A. Özbek. And M. Arik, “An Investigation Into Wetting Dynamics of a Single Droplet Over a Chilled Solid Surface”, ULIBTK Conference, September 11-14, 2019, Kocaeli, Turkey.  

• M. Budakli, T. K. Salem, and M. Arik, “Micro-structured Surfaces in Condensation: Experimental Approach and Heat Transfer Analysis”, 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT 2019), Wicklow-Ireland, July 2019.  
• S. Gulduren, V. C., A. Muslu, and M. Arik, “An İnvestigation into Phase Change Materials for Thermal Management and Efficiency Improvement of Photovoltaic Power Harvesting Systems”, 14th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics, Wicklow-Ireland (HEFAT 2019), July 2019.  
• O. Isil, M. B. Dogruoz, and M. Arik, “An Investigation of Synthetic Jets Performance Emanating from Circular, Elliptical and Rectangular Nozzles”, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.  
• M. Elibol, M. C. Ozaydın and M. Arik, “Development of a Computational Modeling and Experimental Validation Approach for KSF LED Packages in a 65” Ultra-Thin LED TV System”, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.  
• O. Isıl, B. Yucesan and M. Arik, “Impact of Orifice Size over Mechanical, Flow and Thermal Performances of Synthetic Jets”, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.  

• M. Z. Naseem, P. Sendur, and M. Arik, “Impact of Orifice Location on the Mechanical Response of Side and Central Orifice Synthetic Jets, IEEE ITherm Conference - The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 29- June 1, 2018.  
• M. Budakli, T. K. Salem, and M. Arik, “Experimental Investigation on Heat Transfer and Surface Wetting Phenomena During Vapor Condensation on Nano Textured Surfaces, 10th International Conference on Boiling and Condensation Heat Transfer, Nagasaki, Japan, 2018.  

2016-2017

• M. Budakli, T. K. Salem, and M. Arik, “Effect of Micro-Structured Surfaces on Heat Transfer and Surface Wetting Phenomenon During Vapor Condensation”, 21th National Conference of Heat Science and Technology (ULIBTK'17), CORUM, Turkey, September 13-16, 2017.  
• M. B. Dogruoz, M. Arik, S. H. Parsa “An experimental and computational study for thermal and thermodynamics performances of a thin piezofan cooler”, IEEE Itherm Conference 2017, June 2017.  

• A. Muslu, B. Ozluk, E. Tamdogan, and M. Arik, “Impact of Junction Temperature over Forward Voltage Drop for Red, Blue, and Green High Power Light Emitting Diode Chips”, IEEE Itherm Conference 2017, June 2017.  
• M.C. Ozaydin and M. Arik, “Controlled Thermal Design of SLIM LED TV Systems”, IEEE Itherm Conference 2017, June 2017.  
• H. Waheed, M.B. Dogruoz, and M. Arik, “Acoustic Analysis of an Axial Fan”, IEEE Itherm Conference 2017, June 2017.  
• U.Z. Uras, and M. Arik, “Thermal and Optical Challenges in Multi Purpose Automotive Exterior Lighting Systems”, Lighting Professional Symposium, LPs-2016, Bregenz, Austria, November 2016.  
• U.Z. Uras, E. Tamdogan, and M. Arik, “Thermal Enhancement of an LED Light Engine for Automotive Exterior Lighting with Advanced Heat Spreader Technology”, ASME IMECE 2016, IMECE2016-65602, Phoenix, AZ, November 2016.  

• H. M. Hashim, Y. Yasa, M. B. Dogruoz, M. Arik, and E. Mese, “Investigation of power distribution on an axial fan”, IEEE Itherm 2016, Las Vegas, June 2016.  
• S.H. Parsa, O. Ghaffari, S. A. Solovitz, M. Arik, “Flow and Heat Transfer Study of an Impinging Piezoelectric Fan over a Vertical Surface”, ASME Summer Heat Transfer Conference, Washington DC, July 2016.  

2014-2015

• M. Ikhlaq, B. Dogruoz, O. Ghaffari, and M. Arik, “Effect of jet to surface spacing on heat transfer mechanism of round synthetic impinging jet” ASME Interpack 2015, San Francisco, USA, July 2015.  
• S. U. Yuruker, M. Arik, E. Tamdogan, R. Melikov, S. Nizamoglu, and I. Durak, “Thermal and optical performance of eco-friendly silk fibroin proteins as a cavity encapsulation over LED systems”, ASME Interpack 2015, San Francisco, USA, July 2015.  

• H. M. Hashim, B. Dogruoz, M. Arik, M. Parlak, “An investigation into performance characteristics of an axial flow fan using CFD for electronic devices”, ASME Interpack 2015 San Francisco, USA, July 2015.  
• G. Apaydin, G. Subasi, E. Tamdogan, and M. Arik, “An investigation into thermal management of LED based street lighting systems”, LPs2015 Lighting Professional Symposium, Bregenz, Austria, September 2015.  
• S. U. Yuruker, E. Tamdogan, and M. Arik, “An experimental and computational study on efficiency of white LED packages with a thermo-caloric approach”, LPs2015 Lighting Professional Symposium, Bregenz, Austria, September 2015.  
• F. S. Khosroshahi, T. Salem, M. Arık and M. O. Hamdan, “Numerical and experimental Analysis of a heat pipe embedded printed circuit board for solid state lighting applications”, IX Minsk International Seminar -Heat Pipes, Heat Pumps, Refrigerators, Power Sources, Minsk, Belarus, September 2015.  
• O. Ghaffari, B. Dogrouz, M. Arik, “An investigation into momentum and temperature fields of a meso-scale slot synthetic jet for a small jet-to-surface spacing”, IHTC 2014 Conference, Kyoto, Japan, August 10- 15, 2014.  

• E. Tamdogan, and M. Arik, ‘Effect of direct liquid cooling on the light emitting diode local hot spots – A Computational and Experimental Study’’, The 15th International Heat Transfer Conference, IHTC 2013, Japan, August 10-15, 2014.  
• E. Tamdogan, and M. Arik, “Effect of liquid cooling on the performance of optical light extraction for LED systems”, 14th İnternational Symposium on the Science and Technology of Lighting– LS14, Como, Italy, June 2014.  
• O. Ghaffari, B. Dogrouz, M. Arik, “An investigation into momentum and temperature fields of a meso-scale synthetic jet ”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.  
• M.Ikhlaq, O.Ghaffari and M. Arik, “Effect of actuator deflection on heat transfer for low and high frequency synthetic jets”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.  
• M. Arik, K. Kulkarni, C. Royce, and S. Weaver, “Developing a standard measurement and calculation procedure for high brightness LED junction temperature”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.   

• F. S. Khosroshahi, M. Arik, C. S. Tufekci, "A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications”, ITHERM 2014, Orlando, June 2014.  
• M. N. Inan and M. Arik, “Development of figure of merits for energy efficient LED lighting systems”, IEEE Itherm 2014 Conference, Orlando, FL, May 27- June 1, 2014.   
• B. Yang, M. Arik, J. Xu, and A. Bar-Cohen, “Pool boiling and critical heat flux of perfluorocarbon mixtures”, Int. Sym. on Convective Heat and Mass Transfer, Kusadasi, Turkey, June 8 – 13, 2014.  
• E. Tamdogan, and M. Arik, “Numerical investigation of direct liquid cooling and development of new liquids for high brightness light emitting diodes (LEDs)’’Convective Heat and Mass Transfer, CONV-14, Kusadasi, Turkey, June 8-13, 2014.  
• K. Karsli, and M. Arik, “Effect of optical design on the thermal management for the smart TV LED backlight systems”, IEEE 64th Electronic Components and Technology Conference, Orlando, FL, May 27- May 30, 2014.  

2011-2013  

• E. Tamdogan and M. Arik, "Understanding direct liquid cooling of high brightness light emitting diodes (LEDs) in natural convection heat transfer", ASME 2013 International Mechanical Congress & Exposition, IMECE2013, San Diego, CA, November 13-21, 2013.  
• O. Ghaffari, M. B. Dogruoz and M. Arik, “A numerical study of single unsteady laminar slot Jet in a confined structure”, ASME Summer Heat Transfer Conference, Minneapolis, MN, July 15-20, 2013.  
• E. Tamdogan, M. Arik and M. B. Dogruoz, “Direct liquid cooling of high flux led systems: hot spot abatement”, ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2013, San Francisco, CA, July 16-18, 2013.  
• M. Arik, R. Sharma, J. Lustbader, and X. He, “Comparison of synthetic and steady air jets for impingement heat transfer over vertical surfaces”, IEEE Itherm 2012, San Diego, CA, May 28- June 1, 2012.   

• X. He, J. Lustbader, M. Arik, R. Sharma, “Heat transfer characteristics of impinging steady and synthetic jets over vertical flat surface” IEEE Itherm 2012, San Diego, CA, May 28- June 1, 2012.  
• M. Arık, “An investigation into parametric effects on boiling heat transfer”, 9th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics”, HEFAT2012, Malta, 16 – 18 July 2012.  
• M. B. Doğruoz and M. Arik, “Synthetic jets for electronics cooling applications”, HEFAT2012, Malta, 16 – 18 July 2012.  

2009-2010 

• S. Solovitz and M. Arik, “System-level metrics for thermal management technology” IEEE ITHERM 2010, Las Vegas, June 2010.  
• R. Li and M. Arik, “Experimental study on convection heat transfer of a single fin duct with pulsed airflow”, Thermal Issues in Emerging Technologies, ThETA 3, Cairo, Egypt, Dec 19-22, 2010.  

• M. Arik, S. Weaver, and J. Bray, “Nano thermotunneling systems for efficient power generation”, SPIE 2010 Micro/Nano Power Generation Systems Conference, Orlando, FL, April 2010.  
• M. Baris Dogruoz, M. Arik, and Adam Pautsch, “Heat transfer in micro channels: substrate effects and cooling efficiency for rectangular and circular ducts”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.  
• M. Arik, Y. Utturkar, and S. Weaver, “Immersion cooling of light emitting diodes”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.   
• M. Arik, Y. Utturkar, “Vortex dynamics of synthetic jets: A computational and experimental investigation”, Int. Heat Transfer Conference 2010, IHTC14-23099, Washington DC, August 2010.  
• M. Arik, R. Li, K. Andreini, J. Crosby, D. Shaddock, “Development of a measurement technique for highly conductive CVD diamonds and analysis of uncertainties due to 3D heat losses”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.  

• S. A. Solovitz and M. Arik, “Understanding the performance metrics for advanced cooling methodologies”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.  
• R. Li, W. D. Gerstler, M. Arik, B. Vanderplog, “Enhancement of natural convection using synthetic jets”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.  
• P. Salapakkam, R. Li, M. Arik, B. Gerstler, “Augmenting forced convection heat transfer coupled with an aerodynamic surface and a synthetic jet”, ITHERM 2010, Las Vegas, NV, June 2-5, 2010.  
• M. Francoeur, M. Arik, and M.P. Mengüc,“ Estimating near-field thermal radiation between two flat silicon wafers with surface roughness”, Int. Conference on Nano-materials and Nano-systems, Istanbul, Turkey, June 2009.  
• M. Arik, S. Weaver, and J. Bray, “Thermotunneling systems for advanced efficient cooling”, ASME Interpack Conference, IPACK 89109, San Francisco, July 19-23, 2009.  

• M. Arik and M. S. Ulcay, “Sweeping flow heat transfer with piezoelectric fans over vertical flat surfaces”, ASME Summer Heat Transfer Conference, HT2009-88337, San Francisco, July 19-23, 2009.  
• D. Gottapo, A. Rao, Y. Utturkar, and M. Arik, “Reduced-order investigation of synthetic jet cooling for electronics applications”, HT2009-88608, San Francisco, July 19-23, 2009.  
• Y. Utturkar, M. Arik, and T. Icoz, “Thermal characteristics of a synthetic jet integrated heat sink design for air-cooled electronics”, ASME Interpack Conference, IPACK 89109, San Francisco, July 19-23, 2009.  

2007-2008

• M. Arik, Y. Utturkar, and M. Ozmusul, “Effect of synthetic jets over a natural convection heat sink”, ASME International Mechanical Engineering Congress and Exposition, IMECE2008-68784, Boston, MA, October 31- November 6, 2008.  

• M. B. Dogruoz and M. Arik, “An investigation onto the conduction and convection heat transfer from advanced heat sinks”, ITHERM 2008, Orlando, FL, May 28-31, 2008.  
• M. Arik and Y. Utturkar, “Interaction of a synthetic jet with an actively cooled heat sink, ITHERM 2008, Orlando, FL, May 28-31, 2008.  
• C. Royce, M. Arik, S. Weaver, J. W. Bray, V. Ovsyuk, A. Klimenko and A. Yarts, “Thermal conductivity measurements of Si-SiO2-Si sandwich structures for Micro/Nano electronics”, ASME/JSME Thermal Engineering and Summer Heat Transfer Conference 2008, HT-2008-56001, Jacksonville, FL, August 10-14, 2008.  
• J. Petroski, M. Arik and M. Gursoy, “Piezoelectric fans: Heat transfer enhancements or electronics cooling”, ASME-JSME Thermal Engineering and Summer Heat Transfer Conference 2008, HT-2008-56405, Jacksonville, FL, August 10-14, 2008.  
• M. Arik and A. Setlur, “Energy efficient solid state lighting and thermal management for a sustainable future”, Global Conference on Global Warming (GCGW-08), Istanbul, Turkey, July 6-10, 2008.  

• C.E. Seeley, Y. Utturkar, and M. Arik, "Coupled structural and fluid dynamics modeling of a synthetic jet", 49th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics & Materials Conference, Chicago, IL, March, 2008  
• T. Icoz, M. Arik, R. Marchiando, X. Liu, and Z.H. Lu, “Advanced TPG thermal pyrolytic graphite for the thermal management of electronics” IMAPS 2006 Advanced Technology Workshop on Thermal Management, Palo Alto, California, CA, December 2006.  
• B. Kosoy, and M. Arik, “Thermal analysis of plastic serpentine-type microchannel evaporators”, ASME International Mechanical Engineering Congress and Exposition, Seattle, WA, November 11-15, 2007.  
• Y. Utturkar, M. Arik, and M. Gursoy, “Assessment of cooling enhancement of synthetic jet in conjunction with forced convection”, ASME International Mechanical Engineering Congress and Exposition, IMECE2007-41446, Seattle, WA, November 11-15, 2007.  
• M. Arik, J. Petroski, A. Bar-Cohen, and M. Demiroglu, “Energy efficiency of low form factor cooling devices”, ASME International Mechanical Engineering Congress and Exposition, IMECE2007-41275, Seattle, WA, November 11-15, 2007.   

• T. Icoz, M. Arik, and T. Dardis, “Characterization of light weight heat sink materials for thermal management of electronics”, ASME InterPACK '07, Vancouver, British Columbia, Canada, July 8-12, 2007.  
• M. Arik, Y. Utturkar, and M. Gursoy, “Interaction of synthetic jet cooling performance with gravity and buoyancy driven flows”, ASME InterPACK '07, Vancouver, British Columbia, Canada, July 8-12, 2007. 

2004-2006

• C.E. Seeley, M. Arik, R. Hedeen, M. Shih, T. Wetzel, “ Coupled acoustic and heat transfer modeling of a synthetic jet”, 47th AIAA/ASME/ASCE/AHS/ASC Structures / Structural Dynamics and Materials Conference, Newport, Rhode Island, 1-4 May 2006.   
• M. Gursoy, M. Arik, T. Icoz, M. Yovanovich, B., Theodorian, “Effect of 3D diffusion over vertical thin rectangular geometries in natural convection heat transfer”, ASME Int. Mechanical Engineering Congress and Exposition, IMECE2006-13293, Chicago, Illinois, November 5-10, 2006.  
• Y. Utturkar, M. Arik, and M. Gursoy, “An experimental and computational sensitivity analysis of synthetic jet cooling performance”, ASME Int. Mechanical Engineering Congress and Exposition, IMECE2006-13743, Chicago, Illinois, November 5-10, 2006.  

• M. Arik, S. Weaver, A. Setlur, D. Haitko, “Thermal needs and challenges for the solid state lighting devices: Materials to packages”, ASME Int. Mechanical Engineering Congress and Exposition, IMECE2005-79330, Orlando, Florida, November 5-11, 2005.  
• K.S. Yigit, H.M. Ertunc, M. Yakut, M. Arik, “The design of bubble driven micro jet for the thermal management of electronics”, 4th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics (HEFAT2005), Cairo, Egypt, Sep. 19-22, 2005.  
• J. Garg, M. Arik, and S. Weaver, “Impingement air cooling with synthetic jets over small and large heated surfaces”, InterPACK’05 ASME Pacific Rim Technical Conference and Exhibition On Integration and Packaging of MEMS, NEMS and Electronics Systems, IPACK2005-73211, San Francisco, CA, July 17-22, 2005.  
• J. Garg, M. Arik, S. Weaver, and S. Saddoughi, “Micro fluidic jets for thermal management of electronics”, 2004 ASME Heat Transfer/Fluids Engineering Summer Conference, Charlotte, North Carolina, July 11-15, 2004.   
• J. Garg, M. Arik, and E. Tkaczyk , “Methodology for computation and measurement of thermal conductivity for thin film composite substrates”, Ninth Intersociety Conference on thermal and Thermo-mechanical Phenomena in Electronic Systems, Las Vegas, June 1-4, 2004.  

• M. Arik and S. Weaver, “Chip scale thermal management of high brightness LED packages”, 2004 SPIE – The International Society of Optical Engineering Annual Conference, Denver, August 2004.  

2000-2003

• M. Arik, C. Becker, S. Weaver, J. Petroski, “Thermal management of LEDs: Package to system”, SPIE’s 48th Annual Meeting, 5187-9, San Diego, CA, 3-8 August 2003.  
• A. Bar-Cohen, A. Watwe, M. Arik, “Pool boiling critical heat flux in dielectric liquids”, 5th International Conference on Boiling Heat Transfer, Montego Bay, Jamaica, May 4-8, 2003.  
• M. Arik, M. Nagupally, S. Brzozowski, and J. Glaser, "Thermal design and optimization of harsh environment power electronics in natural convection heat transfer", ASME Summer Heat Transfer Conference, HT2003-47015, Las Vegas, Nevada, July 21-23, 2003.  

• M. Arik, S. Weaver, C. Becker, M. Hsing, and A. Srivastava, “Effects of localized heat generations due to the color conversion in phosphor particles and layers of high brightness light emitting diodes”, ASME/IEEE International Electronic Packaging Technical Conference and Exhibition - InterPACK’03, Maui, Hawaii, USA, July 6–11, 2003.  
• J. Garg, M. Arik, A. Bar-Cohen, R.  Wolf, B. Vukasinovic, J. Hartley, and G.A. Glazer, “Synthetic jet enhancement of natural convection and pool boiling in a dielectric liquid”, 12th Int. Heat Transfer Conference, Grenoble, France, August 18-23, 2002.  
• M. Arik, J. Petroski, and S. Weaver, “Thermal challenges in the future generation solid state lighting applications: Light emitting diodes”, Pro. of the ASME/IEEE 8th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, San Diego, May 29, 2002.  
• M. Arik and A. Bar-Cohen, “Ebullient cooling of integrated circuits by Novec fluids”, Proceedings of the ASME/IEEE PACIFIC RIM/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, ASME Paper No: 15515, Hyatt Regency, Kauai, Hawaii, July 8–13, 2001.  
• M. Arik, K. S. Yigit, A. Bar-Cohen, S.M. You, “Correlating surface effects on pool boiling CHF”, ASME Nat. Heat Transfer Conference, Pennsylvania, August 2000.  

• M. Arik and A. Bar-Cohen, “Immersion cooling of high heat flux microelectronics with dielectric liquids”, Int. Symposium and Exhibit on Adv. Packaging Materials: Process, Properties and Materials, Atlanta, GA, pp. 229-247, March 15-18, 1998.  
• K.S. Yigit, M. Arik and A. Bar-Cohen, “New CHF enhancement techniques: Passive impeller micropump and gravity driven fluid flow”, 5th World Conference on Experimental Heat Transfer, Fluid Mechanics, and Thermodynamics, Thessaloniki, September 24-28, 2001.  
• M. Arik, S. M. Zurn, K. S. Yigit, A. Bar-Cohen, “Design, fabrication and experimental-numerical study of PZT sensors”, Pro. of the Modeling and Simulation of Micro Electro Mechanical Systems – MSM 2000, San Diego, CA, March, 2000.

1996-1999

• M. Arik, S. M. Zurn, A. Bar-Cohen, Y. Nam, D. Markus and D. Polla, “Development of CAD model for MEM micropumps”, Int. Conf. on Modeling and Simulation of Microsystems - MSM 99, P. Rico, 1999.  
• M. Arik, A. Bar-Cohen, “Thermal management of next generation packaging (SLIM)”, Packaging   Research Center 2nd Academic Conference, Georgia Institute of Technology, GA, 1998.  

• M. Arik, C.A.C. Santos, S. Kakac, “Experimental and theoretical analyses of unsteady turbulent forced convection with time wise variation of inlet temperature”, International Symposium on Transient Convective Heat Transfer, Cesme, Turkey, August 19-23, 1996.  
• N. Sozbir, M. Arik, S. Kakac, H. I. Sarac, I. Calli, “Experimental investigation of unsteady turbulent forced convection in a rectangular duct with arrays of block-like electronics components”, International Symposium on Transient Convective Heat Transfer, Turkey, August 19-23, 1996.  
• N. Sozbir, D. M. Brown, S. Kakac, M. Arik, C.A.C. Santos, "Unsteady forced flow in parallel plates channel with and without protruding surfaces", 9th International Conference on Thermal Engineering and Thermogrammetry, Hungary, May 31-June 2, 1995.  
• A. Dogan, M. Arik, K.S. Yigit, “Design of air cooled oil cooler for a turbo-prop aircraft”, 1999 Asia-Pacific Conference on the Built Environment, Taipei, Taiwan, November 1999.