Both Dr. Omidreza Ghaffari and Mete Muslu was awarded ASME's awards given to highly cited research paper and student member of the year awards respectively, at a recent ASME Interpack Conference in in San Diego in October 2023.

Dr. Omidreza Ghaffari, an alumni of ARTgroup, received ASME Journal of Electronics Packaging Best Paper Award for the year 2023 for his work on a novel cooling technology applicable to advanced electronics especially in data centers. His paper appeared in the Journal of Electronic Packaging (December 2022, Volume 144, Issue 4) entitled "Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics". His award was presented at ASME 2023 InterPACK Conference in San Diego, California on October 25, 2023.

Mr. Muslu obtained his B.Sc. and M.Sc. degrees in mechanical engineering in 2018 and 2020, respectively, from Ozyegin University, Istanbul, Turkey, where he was supervised by Dr. Mehmet Arik. He is currently pursuing a Ph.D. degree in mechanical engineering at the Georgia Institute of Technology, Atlanta, GA, USA, with a focus on vertically integrated power delivery and thermal management in SiC drive inverter packages. Mr. Muslu was a member of a competition team that received the Best Commercial Potential Award for developing a novel thermal connector design sponsored by the U.S. Defense Advanced Research Projects Agency (DARPA) in 2015. He also received the Outstanding Poster Award at the InterPACK Conference in 2021 for his work entitled “Exploration of Multi-physics Design Trade-offs in a Multi-Chip SiC MOSFET Module with Integrated Cooling.”