Pradeep Lall

Mechanical Engineering
John and Anne MacFarlane Endowed Distinguished Professor and Alumni Professor
Director, Auburn University Electronics Packaging Research Institute
1438 Wiggins Hall
334.844.3424
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Website
Auburn University Electronics Packaging Research Institute

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Education

Ph.D. Mechanical Engineering, University of Maryland
M.B.A. Finance and Strategy, Northwestern University
M.S. Mechanical Engineering, University of Maryland
B.E. Mechanical Engineering, Delhi College of Engineering

Research Interests

Flexible Hybrid Electronics
Harsh Environment Electronics
Semiconductor Packaging
Prognostics Health Management
Shock and Vibration

In The News

Auburn vision for flexible electronics future aligns with major focus of CES 2025

Auburn University's Electronics Packaging Research Institute (EPRI) was established this past summer. Judging by the reports of wide-eyed, gizmo-giddy tech journalists covering the annual Consumer Electronics Show (CES), the timing couldn't have been better.
EPRI director Lall honored for exceptional contributions to electronics manufacturing

Pradeep Lall, the MacFarlane Distinguished Professor and Alumni Professor in the Department of Mechanical Engineering, and the Director of the Auburn University Electronics Packaging Institute (EPRI), is the 2024 recipient of the Surface Mount Technology Association (SMTA) Founder’s Award. The Founder’s Award, SMTA's highest honor, recognizes members who have made exceptional contributions to the electronics manufacturing industry, and to the SMTA. The award was conferred at the 40th SMTA Conference in Rosemont, Illinois.
EPRI team wins top honors at ASME INTERPACK 2024 for additive in-mold electronics advancements

The research team within the newly established Auburn University Electronics Packaging Research Institute (EPRI) is working to turn science fiction into reality by embedding electronic controls directly into car surfaces — and the American Society of Mechanical Engineers (ASME) is taking notice. 
Auburn establishes Electronics Packaging Research Institute

Auburn University's seminal work on semiconductor packaging has new packaging of its own — the Auburn University Electronics Packaging Research Institute (EPRI).
Auburn center’s FHE reputation underscored with multiple winning additively manufactured electronics proposals

If you're trying to gauge Auburn's preeminence in harsh environment electronics resiliency development and flexible hybrid electronics (FHE) research, look no further than the latest project call of the NextFlex National Manufacturing Institute.
Electronics sustainability focus of mechanical engineering professor's latest SRC program success

The decades-long legacy of competitively won Semiconductor Research Corporation (SRC) programs secured by Pradeep Lall continues to grow.  Lall, the MacFarlane Endowed Distinguished Professor and Alumni Professor in the Department of Mechanical Engineering, recently won a $315,000 SRC proposal focused on the development and characterization of non-per- and polyfluoroalkyl substance (non-PFA) materials for electronics packaging. 
Mechanical engineering professor wins international research award

Pradeep Lall, the MacFarlane Endowed Distinguished Professor of mechanical engineering, is the 2023 recipient of the SEMI FlexTech prestigious FLEXI Award for R&D Achievements. The award, which recognizes world-class research originality in demonstrating the commercial potential for flexible hybrid electronics (FHE) or printed electronics, was conferred at the FLEX Conference held in San Francisco July 11-13.
Mechanical engineering professor wins Avram Bar-Cohen Memorial Medal

Pradeep Lall, the MacFarlane Endowed Distinguished Professor of Mechanical Engineering, is the inaugural winner of the American Society of Mechanical Engineers (ASME) Avram Bar-Cohen Memorial Medal. The honor was conferred at the 2022 ASME InterPACK Conference recently held in Garden Grove, Calif. The InterPACK is a flagship conference of the ASME Electronics and Photonic Packaging Division (EPPD and focuses on electronics packaging and heterogeneous integration.
Mechanical engineering professor wins multiple grants for AM sustainability and extreme environment electronics

The Samuel Ginn College of Engineering’s preeminence in harsh environment electronics resiliency research was recently on full display in the latest project call of the NextFlex National Manufacturing Institute.

Flexible hybrid electronics explained on #GINNing Podcast

Rigid technologies are quickly going the way of the buffalo thanks to the research and vision of Auburn experts like Pradeep Lall.
Mechanical professor honored with IEEE Biedenbach Outstanding Engineering Educator Award

Pradeep Lall, the John and Anne MacFarlane Endowed Distinguished Professor of mechanical engineering, is the recipient of the IEEE Region 3 Biedenbach Outstanding Engineering Educator Award for 2020, which recognizes those who have made outstanding contributions to the electrotechnology profession through teaching in industry, government or in an institution of higher learning. 
Mechanical engineering professor named NextFlex Fellow

NextFlex, America’s Flexible Hybrid Electronics Manufacturing Institute, recognized Pradeep Lall at its recent FLEX conference in Monterey, California, as an individual who has accelerated the growth of the flexible hybrid electronics industry.

Lall’s flexible electronics research featured on Voice of America

The Voice of America piece highlighted the latest technical innovations in flexible electronics, including the Flexible Biometric Band developed by Pradeep Lall’s research group.

3 Auburn engineers recognized with university-wide faculty awards

Auburn Engineering faculty members Shiwen Mao, Pradeep Lall and Virginia Davis were honored for their research endeavors and mentorship at the Auburn University Faculty Awards ceremony.
Pradeep Lall wins IEEE Outstanding Sustained Technical Contributions Award

Pradeep Lall, MacFarlane Professor in mechanical engineering, is the 2018 recipient of the IEEE outstanding Sustained Technical Contributions Award,