Electronics Research Institute
AUERI Review
AUERI Consortium Fall 2024 Semi-Annual Technical Review Meeting
Auburn University Electronics Research Institute (AUERI) will hold its Fall Technical Review and Project Planning Meeting on Sept. 25-26, 2024 in Auburn University Wiggins Hall. All current members of the Consortium are invited to attend. The following projects will be presented at the meeting:-
- Microstructural Evolution in Aging Lead Free Solders
- Effects of Thermal Cycling on the Material Behavior of Lead Free Solders
- Micromechanical Modeling of Lead Free Solders
- Damage Mechanics of Chip-UF Interface under Monotonic and
Fatigue Loading - Feature Vector Based Remaining Useful-Life Assessment in Mechanical
Shock and Vibration for Leadfree Electronics - Modeling Effect of Underfill Property Evolution on the FCBGA
Reliability at Sustained Automotive Underhood Temperatures - High Strain Rate Properties of M758 Solder at Extreme Operating
Temperatures - Sustained High Temperature Effect on the Critical Stress Intensity
Factor of the Substrate-UF Interface subjected to Monotonic and
Fatigue Loading - Reliability under Dynamic Folding and Humidity for a Direct-Write
Additively Printed Temperature Sensor on Flexible Substrate with
Polyimide Encapsulation for AstroSENSE Wearable Applications - Component Attachment on Inkjet Printed Metallization for Signal
Filters and Multilayer Circuits - Effect or High and Low Storage Temperature, Storage Duration and
Varying Depth of Discharge on Coin-Cell SOH Degradation - Development of Multi-layer Circuitry Using ECA and LTS Material
For Surface-mount Component Attachment - Effect of Lamination Parameters and Mechanical Folding on SOH
Degradation of Li-Ion Battery Subjected to Accelerated Life Testing - Extreme Low-Temperature High Strain-Rate Constitutive Behavior
Evolution of Doped and Undoped SnAgCu Leadfree Solders under
Sustained High Temperature Exposure - Interfacial Fracture Toughness of PCB-Potting Compound Interfaces
under Sustained High Temperature Exposure and Non-
Perpendicular High-G Shock - Reliability Assessment of Cu-Al WB under Automotive Temperatures
in Presence of Ionic Contamination and Voltage Bias - Characterization of Linear Viscoelasticity Evolution of Epoxy
Molding Compounds Subjected to High Temperature Long-Term
Aging - Evolution of High Strain Rate Mechanical Properties of SAC-R,
QSAC10 and QSAC20 with High Temperature Storage at 50℃
with High and Low Operating-Temperatures - Repeatability and Extended Time Stability Study of an Additively
Printed Strain Gauge Under Different Load Conditions - Performance Characteristics of Additively Printed Strain Gauges
under Different Conditions of Temperature and High Stress Loads - Reliability Characterization and Modeling of Flexible LCO battery
Under Flexing and Calendar Aging for SOH degradation analysis - Interaction of Photonic Curing Process Parameters on Additively
Printed Copper Circuits - Effect of U-Fold Radius on SOH Degradation of Li-ion Batteries
subjected to U-Flex-to-Install and Dynamic U-Fold - Thermal Cycling Reliability of Newly-Developed Solder Materials
for Automotive and Harsh Applications - Thermal Cycling of Different SAC Solder Alloys Compared to
SnPb - Drop Shock Performance of Different SAC Solder Alloys Compared
to SnPb - Fatigue Performance of Individual Lead-free Solder Joints
- Electronic Interconnections under Varying Amplitude Cycling
- Session-7: Second-Level Interconnects and Thermal Management
- Effects of Aging on the Cyclic Fatigue Life of Pb-Free Alloys
- Convective Cooling of High-Power Electronics
- Thermal Materials Testing
AUERI Spring 2024 Review Location
Mechanical Engineering
354 War Eagle Way
1409 Wiggins Hall
Auburn University, Auburn, AL
Contact Information
Department of Mechanical Engineering
1418 Wiggins Hall,
Auburn University, Auburn, AL
Phone: (334) 844-3424
UPCOMING CONFERENCES WITH AUERI Presenters
IEEE ITHERM 2024
ITherm 2024 will be held along with the 74th Electronic Components and Technology Conference, a premier electronics packaging conference at he Gaylord Rockies Resort & Convention Center in Denver, Colorado, USA. Joint registrations will be available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2024 will include panel discussions, keynote lectures by prominent speakers, invited technology talks, ECTC/ITherm joint networking events and short courses, and a student design competition.
IEEE ECTC 2024
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society. The 2024 conference will be held in Denver Colorado on May 28-31.
IRPS 2024
For over 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world, IRPS seeks to understand the reliability of semiconductor devices, integrated circuits, and microelectronic systems through an improved understanding of both the physics of failure as well as the application environment. IRPS provides numerous opportunities for attendees to increase their knowledge and understanding of all aspects of microelectronics reliability. It is also an outstanding chance to meet and network with reliability colleagues from around the world.
ASME INTERPACK 2024
InterPACK is the premier international conference for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration.
InterPACK 2024 Tracks:
- Heterogeneous Integration
- Data Centers and Modular Edge Systems
- Electronics Packaging
- Power/RF Electronics and Photonics
- Multiscale Thermal Transport and Energy Storage
- Flexible, Wearable, and Printed Electronics
- Transportation Systems, AI and Machine Learning
- Interactive Presentations
- Panels, Tutorials, and Workshops
iMAPS
The 20th Annual Device Packaging Conference (DPC 2024) will be held at the WeKoPa Resort and Conference Center, from March 18-21, 2024. It is an international event organized by the International
Microelectronics Assembly and Packaging Society (IMAPS).
