Auburn establishes Electronics Packaging Research Institute
Published: Aug 19, 2024 9:55 AM
By Jeremy Henderson
Auburn University's seminal work on semiconductor packaging has new packaging of its own — the Auburn University Electronics Packaging Research Institute (EPRI).
The institute’s recent establishment marks a significant new emphasis on the semiconductor packaging research conducted through Auburn's Center of Advanced Vehicle and Extreme Environment Electronics, or CAVE3, which was founded in 1999 through funding from the National Science Foundation and support from select companies focusing primarily on automotive electronics.
Pradeep Lall, John and Anne MacFarlane Endowed Distinguished Professor and Alumni Professor in the Department of Mechanical Engineering, has directed the center since 2008. He will continue to serve as director of EPRI.
“Our need for domestic capability in manufacturing, research and development for semiconductor packaging has really entered the national conversation recently with the recent establishment of the National Advanced Packaging Manufacturing Program (NAPMP) under the Creating Helpful Incentives to Produce Semiconductors — or CHIPS — Act,” Lall said.
In June 2021, the White House identified four key product areas of vulnerability, with semiconductor manufacturing and advanced packaging topping the list.
The report recognized the role of semiconductor packaging as an important avenue for innovation in the density and size of electronic products; the U.S. global share of semiconductor production has dropped from 37 percent in 1990 to only 12 percent today.
“In this current environment, we’re realizing the criticality of electronics in general and semiconductor packaging in particular for securing the supply chain and enabling advanced system functionality both in the U.S. and Europe,” Lall said.
Under Lall’s leadership, Auburn’s work along these lines has grown exponentially, especially over the past decade.
In 2015, he led the Auburn team contributing to the winning proposal that resulted in the foundation of the NextFlex National Manufacturing Institute. Auburn is a tier-1 founding member of NextFlex, whose mission is to advance U.S. manufacturing of flexible hybrid electronics; Lall serves on the NextFlex technical council and has previously served on the governing council of the institute.
“Growing CAVE3 into the Auburn University Electronics Packaging Research Institute was the logical next step for our activities in this important area of research," said Dean of Engineering Mario Eden. "It's recognition of its broadened focus, breadth of sponsored research, as well as its international standing.”
Steve Taylor, senior vice president for research and economic development, agrees.
"This expansion reflects not only Auburn's ever-widening range of research areas, but it will also increase the resources and capabilities to further our mission of advancing electronics packaging technologies and solidifying our reputation as a global leader in the field," Taylor said.
In accordance with its expanded scope, EPRI will partner with several campus offices and colleges, including the Auburn University Research and Technology Park (ARTP), the College of Science and Mathematics, the Samuel Ginn College of Engineering and the Auburn Office of AVP Economic Development.
EPRI will interface with ARTP for technology commercialization, and with small and medium-sized companies across the state and nation for education pertaining to workforce development. Economic Workforce Development (EWD) will be explicitly pursued in the field of electronic packaging through an interface with the Office of AVP of Economic Development.
“We look with excitement to the future as Auburn University, through EPRI, looks to contribute to the national focus on advanced electronics manufacturing with a broader emphasis on workforce development, new product launch and technology commercialization,” Lall said.
Pradeep Lall, the MacFarlane Endowed Distinguished Professor and Alumni Professor of mechanical engineering, displays an in-mold galvanic skin response sensor for automotive applications additively manufactured at the Auburn University Electronics Packaging Research Institute.
