Test Services

Accelerated Testing and Qualification

NSF-CAVE³, a national center of excellence in harsh environment electronics provides independent test services for PCB & Electronics Manufacturers, OEMs, CEMs & their greater supply chain partners. CAVE³ Labs, provides a complete suite of high-quality test programs accompanied by our analytical and consulting services conducted at our state-of-the-art facility at Auburn University, Alabama. All Testing in accordance with JEDEC, ASTM, IPC, Military, UL, Commercial and Customer specifications.

Electrical Testing

Arc Resistance
Capacitance
Comparative Tracking Index (CTI)
COnductive/Contact Resistance
Continuity
Dielectric Breakdown
Dielectric Strength
Dielectric Withstanding Voltage (DWV)
High Current Arc Ignition (HAI)
Insulation Resistance (IR)
Interconnection Resistance
Premittivity (Dielectric constant)
Loss Tangent (Dissipation Factor)
Surface Insulation Resistance (SIR)
Volume and Surface Resistivity
Wrapper Resistance (Wire Wrap)

Environmental Testing

Conducting Anodic Filament (CAF) Testing
Electromigration Resistance (ECM)
Humidity
Immersion
Moisture Resistance
Steam Aging
Surface Insulation Resistance (SIR)
Temperature Aging
Temperature Cycling
Thermal Shock
Thermal Stress
Solder Reflow Simulations

Mechanical/Physical Testing

Adhesion
Bond Strength
Dynamic Mechanical Analysis (DMA)
Thermal Gravimetric Analysis (TGA)
Elongation
Flexibility Endurance
Flexural Fatigue
Flexural Strength
Folding Flexibility
Fracture Toughness
Lap Shear
Peel Strength
Rework Simulation
Shear Strength

Tensile Strength (05 grams to 30,000 lbs)
Compressive Strength
Terminal Strength
Thermal Mechanical Analysis (TMA)
Cleanliness
Coating Thickness (XRF)
Differential Scanning Calorimetry (DSC)
Dimensional Inspection and Verification
Failure Analysis
Flammability (UL 94, etc)
Hot Wire Ignition (HWI)
Microsectional Evaluation
Visual Inspection
Workmanship Evaluation