General Status Information - Updated 4/4/07
NEW THIRD EDITION
The Third Edition was published in January
2007 and is available from McGraw-Hill.
Solutions Manual: The Solutions Manual
is complete and available to instructors via the McGraw-Hill ARIS System. A CD version of the manual can be
obtained directly from Richard C. Jaeger (jaeger@eng.auburn.edu).
Answers to Selected
Problems are available as a PDF file.
Updated Power Point Slides will be available
for Fall 2007 classes.
SECOND
EDITION
Solutions Manual: CD and/or printed versions of the manual can be obtained directly from Richard C. Jaeger (jaeger@eng.auburn.edu).
Lecture notes in Power Point form and JPEG versions of the figures are available for all chapters.
http://hobbes.ee.virginia.edu/mh/mcd/ Contact the authors for access permission.
FIRST EDITION
Third Printing:
PSPICE Files: PSPICE files for more than 100 circuits from the figures in the text are available via anonymous ftp. The circuits are available in PSPICE Schematic Form as well as SPICE Netlist Form.
Solutions Manual: CD copies of the Solutions Manual may be requested from the Richard C. Jaeger.
End-of-chapter SPICE Files: A Power Point File containing figures for all the SPICE listings at the end of each chapter is also available via anonymous ftp.
Power Point Slides: The original drawings from the text are available as Power Point Slides and can be obtained from the anonymous ftp site. All files were updated including figures that were inadvertently omitted from Chapter 7.
SPICE Book: A companion text Computerized Circuit Analysis Using SPICE Programs by B. M. Wilamowski and R. C. Jaeger is available from McGraw Hill (ISBN 0-07-032484-0). Chapter 1 introduces SPICE simulation. Chapter 2 contains a wide range of SPICE simulation examples that follow the chapter sequence in Microelectronic Circuit Design. Chapter 3 provides an overview of numerical methods of circuit analysis. Chapters 4 and 5 provide a comprehensive reference for SPICE and detail the differences between the PSPICE, SPICE-2 and SPICE-3 implementations. Chapter 6 presents a description of the device models and model parameters used in SPICE.
Translations: Chinese, Greek, Italian, Korean, and Spanish translations of Microelectronic Circuit Design are available from McGraw-Hill International.
