Prof. Fa Foster Dai

Godbold Endowed Chair Professor

Fellow of Institute of Electrical and Electronics Engineers (IEEE) 

Fellow of National Academy of Inventors (NAI)

        Fa Foster Dai (M’92–SM’00-F’09) received a Ph.D. degree in electrical and computer engineering from Auburn University, AL, USA in 1997 and a Ph.D. degree in electrical engineering from The Pennsylvania State University, PA, USA in 1998.

       From 1997 to 2000, he was with Hughes Network Systems of Hughes Electronics, Germantown, Maryland, where he was a Member of Technical Staff in very large scale integration (VLSI), leading analog and mixed-signal IC designs for wireless and satellite communications.

        From 2000 to 2001, he was with YAFO Networks, Hanover, Maryland, where he was a Technical Manager and a Principal Engineer in VLSI designs, leading high-speed SiGe IC designs for fiber networks

       From 2001 to 2002, he was with Cisco-Cognio Inc., Gaithersburg, Maryland, leading radio frequency (RF) ICs for integrated multi-band wireless transceivers. From 2002 to 2004, he served as a technical consultant for Cognio Inc.

       In August 2002, he joined Auburn University in Auburn, Alabama, USA, where he is currently a Godbold Endowed Chair Professor in electrical and computer engineering. His research interests include analog, mixed-signal and RF circuit designs, and ICs for communication sub-systems such as frequency synthesizers and data-converters. He co-authored eight books and book chapters including Integrated Circuit Design for High-Speed Frequency Synthesis (Artech House Publishers, Feb. 2006) and Low-Noise Low-Power Design for Phase-Locked Loops-Multi-Phase High-Performance Oscillators (Springer International Publishing AG, Nov. 2014).

       Dr. Dai has served as the Guest Editor for IEEE Journal on Solid State Circuits in 2012 and 2013 and the Guest Editor for IEEE Transactions on Industrial Electronics in 2001, 2009 and 2010. He has served on the technical program committees (TPC) of the IEEE Symposium on VLSI Circuits from 2005 to 2008. He currently serves on the steering committee of IEEE Custom Integrated Circuits Conference (CICC) and the TPC of IEEE Radio Frequency Integrated Circuits Symposium (RFIC). He was the 2016 TPC Chair and the 2017 General Chair of IEEE Bipolar / BiCMOS Circuits and Technology Meeting (BCTM). He has served as the 2019 TPC chair, the 2020 conference chair, and the 2021 general chair for IEEE Custom Integrated Circuits Conference.

      Dr. Dai received the Senior Faculty Research Award for Excellence from the College of Engineering of Auburn University in 2009 and was awarded the Distinguished Graduate Faculty Lectureship from Auburn University in 2021. He received IEEE Region 3 Outstanding Engineer Award in 2023. He holds 18 U.S. patents and was named the Fellow of National Academy of Inventors in 2021. He was elected IEEE Fellow in 2009 “for contributions to high-speed frequency synthesis and radio frequency integrated circuits”.