CAVE3 Review
March 7-8, 2007
Miscellaneous Posters
Lead Free Soldering
- Lead Free Soldering
- Alpha OM-325 Pb-Free Solder Paste Wetted to Entek OSP Board Finishes
- Alpha OM-338 Pb-Free Solder Paste Wetted to Entek OSP Board Finishes
- Alpha OM-338T Pb-Free Solder Paste Wetted to Entek OSP Board Finishes
- Alpha SAC 105 Solder Alloy Wetted to Entek Plus OSP (no flux)
- Alpha SAC 105 Solder Alloy Wetted to Entek Plus OSP (with WSX flux)
- Alpha SAC 305 Solder Alloy Wetted to Entek Plus OSP (no flux)
- Alpha SAC 305 Solder Alloy Wetted to Entek Plus OSP (with WSX flux)
- Alpha SAC 405 Solder Alloy Wetted to Entek Plus OSP (no flux)
- Alpha SAC 405 Solder Alloy Wetted to Entek Plus OSP (with WSX flux)
- Alpha SAC 405 Solder Alloy Wetted to McDermid Ag-Cu (no flux)
- Alpha SAC 405 Solder Alloy Wetted to McDermid Ag-Cu (with WSX flux)
- Alpha SAC 405 Solder Alloy Wetted to Cookson Ni-Au (no flux)
- Alpha SAC 405 Solder Alloy Wetted to Cookson Ni-Au (with WSX flux)
- Alpha SAC 405 Solder Alloy Wetted to Photocircuits Pd-Ni (no flux)
- Alpha SAC 405 Solder Alloy Wetted to Photocircuits Pd-Ni (with WSX flux)
- Alpha SACX Solder Alloy Wetted to Entek Plus OSP (no flux)
- Alpha SACX Solder Alloy Wetted to Entek Plus OSP (with WSX Flux)
- Alpha SACX+Ni Solder Alloy Wetted to Entek Plus OSP (no flux)
- Alpha SACX+Ni Solder Alloy Wetted to Entek Plus OSP (with WSX flux)
- Alpha Sn-37Pb Solder Alloy Wetted to Entek Plus OSP (no flux)
- Alpha Sn-37Pb Solder Alloy Wetted to Entek Plus OSP (with WSX flux)
- Creep Constitutive Modeling for Lead-Free Solders
- The Influence of Elevated Temperature Aging on the Properties of Lead-free Solders
- Investigation of the Mechanical Behavior of SACX Lead-Free Solder
- Study on Microstructure Evolution and Mechanical Properties of SAC/Sn-Pb Mixed Formulation Solders
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- Harsh Environment Substrate Performance
- Overmolding for Harsh Environments
Flip-Chip and Underfills
- Flip Chip and Underfills
- Stress Measurements in Large Area Array Flip Chip Packages
- Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life Testing
- Thermal Cycling Reliability of Flip Chip Packages
- Isothermal Aging Effects on Underfill Creep Behavior
- Comparison of Multi-layer PCB CTE using STABLCOR & Thermount Substrates
- RVE and RSA based Techniques for Non-Linear Properties of Nano-Underfills in Extreme Environments
Connector Reliability
- Connector Reliability
- A Thermo-Mechanical Electrical Connector Model Including Multi-Scale Contact Resistance and Finite Element Modeling
- The Effect of Initial Connector Insertions on Electrical Contact Resistance
- Whisker Growth on Metallic Substrates Other Than Brass
- The Influence of Plating Surface Characteristics on Tin Whisker Growth
- Influence of Connector Contact Interface Forces on Tin Whisker Growth
- The Application of Simulation Techniques to the Prediction of Vibration-Induced Fretting Degradation: Analysis of a Blade/Receptacle Pair
Component Reliability
- Component Reliability
- Initiationand Progression of Failures during Shock in Electronics Packaging
- ModelingShock-Failures in Electronics Packaging
- Thermo-MechanicalModels for Area-Array and 3D Packaging
- Multi-variate Regression Methods for Selection of CBGA Packages For Extreme Environments
- Multi-variate Regression Methods for Selection of CCGA Packages For Extreme Environments
- Implementation of the Material Database in CAVE Software Tools
- Prognostics Health Management and Damage Relationships of Leaded and Lead-Free Devices in Thermal Aging Harsh Environments
- Prognostics Health Management and Damage Relationships of Leaded and Lead-Free Devices in Thermal Cycling Harsh Environments
- Wear Simulation of Fuzz Button Contacts in Embedded 3D-Modules in the Presence of Lunar Dust
- Thermomechanical Reliability of Microperl SOL
- Reliability Modeling of 3D Packages: DPACK
- Principal Components and Stepwise Regression Methods for Selection of Flip Chip Packages for Extreme Environments