CAVE3 Review
September 10-11, 2008
Lead Free Soldering
- Lead Free Soldering
- Creep Characterization of SACX0307 Lead Free Solder
- The Influence of Aging Temperature and Silver Content on the Creep Properties of SAC Solder Alloys
- Creep Behavior of Mixed Formulation Solders
- Pb-Free Wetting for Cookson Exotic Alloys
- Toward Flux-Free Wetting in Pb-Free Systems
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- Module Overmolding for Harsh Environments
- Component Termination for Electrically Conductive Adhesives
- Thermal Performance of Laminate to Aluminum Attachment Materials
- In-Situ Environmental Testing for Solder Joint Reliability: Alternative Method (II)
Flip Chip And Underfills
- Flip Chip and Underfills
- The Effects of Isothermal Aging on Underfill Stress-Strain Behavior
- Isothermal Aging Effects on Underfill Creep Behavior
- Thermo-Mechanical Reliability of Flip Chip Assemblies with Multilayer Underfills
- Reliability of 3D DPACK Packaging
- Experimental and Computational Evaluation of Dies Stress in Microprocessor Packaging
- Impact of Piezoresistive Coefficient Uncertainty on Die Stress Measurements
- Characterization of an LCP Socket for Flip Chip Microprocessor Packaging
Connector Reliability
- Connector Reliability
- Hydraulic Solenoid Valve Reliability and Modeling Study
- Three Dimensional Model Refinement for Vibration-Induced Fretting Corrosion
- Modeling Thermally Driven Fretting Corrosion
- Growth of Sn Whiskers on Ultra-Thin Sn Films - "Draining the Swamp"
- Sn Whisker Growth on Patterned Sn
- The Influence of Surface Characterization on Contact Resistance Levels
- Reliability Testing for Harsh Environmental Connectors
Component Reliability
- Component Reliability
- PCR Life-Prediction Models for Cu-Core Assemblies
- PCR Life-Prediction Models for No-Core Assemblies
- Condition Monitoring of High Reliabiltiy Systems
- Prognostics of Leadfree Alloys under Isothermal Loads
- Prognostics of Leadfree Alloys under Thermal Cycling Loads
- Thermo-mechanical Reliability of High I/O BGAs
- Thermo-mechanical Reliability of Low-Silver Leadfree Alloys
- Thermo-mechanical Reliability of Micropearl SOL and Copper Column Area Array Packages
- Cohesive Zone Models for Area-array Packages
- Shock Models for Advanced Interconnect Area-Array Ceramic Packages
- Thermo-mechanical Reliability of Power SSO-12 Packages
- Condition Monitoring of Missille Critical Systems
- CAVE Online Simulation Tools