AMSec 2022: International Workshop on Additive Manufacturing (3D Printing) Security

Call for Papers

The need to secure physical and cyber-physical systems which rely on 3D-printed parts gives rise to a corresponding need to understand potential attacks via AM systems, and to develop countermeasures that will enable attack prevention, detection, and investigation. So far, three major security threat categories have been identified for AM: theft of technical data (often referred to as violation of Intellectual Property, IP), sabotage of AM, and manufacturing of illegal objects. AM Security is the highly multi-disciplinary field of research that addresses these threats.

The aim of this Workshop is to present recent advances in AM Security, including both offensive and defensive approaches. This workshop further welcomes publications in closely related fields, such as Industry 4.0 Security and Supply Chain Security.

The topics of interest include the following:

• Compromises of AM systems and manufacturing environment
• Security threats and attacks in the AM context
• Approaches to prevent attacks on or with AM
• Approaches to detect ongoing attacks on or with AM
• Digital Investigation and forensics in the AM context
• Legal aspects of attacks on or with AM
• Misuse of AM in illegal, terroristic, or nuclear proliferation activities
• Comparative analysis of AM vs. CPS, IoT, Industry 4.0, etc. Securities
• Taxonomies of attacks or defense measures in the AM context
• Surveys of AM Security literature
• Surveys of AM Security posture in industry and agencies
• AM Security-related standardization needs and efforts
• Education of AM Security or related topics

Submissions

All submitted papers will be evaluated based on their relevance to the workshop scope, novelty, merits, quality of execution, and presentation. Submitted papers may be rejected for being out of scope, at the discretion of the PC chairs. Authors who have questions about whether their paper is in scope are encouraged to ask the PC chairs in advance.

We are accepting both Full and Short Papers. All submissions must be a PDF file in double-column ACM format (see https://www.acm.org/publications/proceedings-template, with a simpler version at https://github.com/acmccs/format), no more than 12 pages long excluding the bibliography, well-marked appendices, and supplementary material. Short, high-quality papers are also encouraged and will be considered. Note that reviewers are not required to read the appendices or any supplementary material. Authors should not change the font or the margins of the ACM format. Submissions not following the required format may be rejected without review.

Submissions are to be made to the submission web site at https://amsec22.hotcrp.com/

• Paper submission due: June 24, 2022 July 10, 2022
• Notification to authors: August 5, 2022 August 15, 2022
• Camera ready version due: September 5, 2022 September 14, 2022

Program Chairs

• Mark Yampolskiy, Auburn University, US
• Moti Yung, Google LLC and Columbia University, US

Program Commitee

• Chris Adkins, Identify3D, US
• Irfan Ahmed, Virginia Commonwealth University, US
• Sofia Belikovetsky, X, The Moonshot Factory (formerly Google[X]), Israel
• Satish T. S. Bukkapatnam, Texas A&M University, US
• Gabriela Ciocarlie, CyManII and The University of Texas at San Antonio, US
• Joel Dawson, Oak Ridge National Laboratory, US
• Kristian Dehaan, Kansas City National Security Campus, US
• Mohammad Abdullah Al Faruque, University of California Irvine, US
• William E. Frazier, Pilgrim Consulting LLC, US
• Jacob Gatlin, Auburn University, US
• Alexander Liu, ASTM International, Singapore
• Ying Liu, Cardiff University, UK
• Joshua Lubell, National Institute of Standards and Technology, US
• Eric MacDonald, The University of Texas at El Paso, US
• J. Todd McDonald, University of South Alabama, US
• Fahad A. Milaat, National Institute of Standards and Technology, US
• Jitesh Panchal, Purdue University, US
• Panagiotis Papadimitratos, KTH Royal Institute of Technology, Sweden
• Hammond Pearce, New York University, US
• Mohsen Seifi, ASTM International, US
• Nima Shamsaei, Auburn University, US
• Sujeet Shenoi, University of Tulsa, US
• Anthony Skjellum, University of Tennessee at Chattanooga, US
• Logan Sturm, Oak Ridge National Laboratory, US
• Nils Ole Tippenhauer, CISPA Helmholtz Center for Information Security, Germany
• Yan Wang, Georgia Institute of Technology, US
• Paul Witherell, National Institute of Standards and Technology, US
• Yaoyao (Fiona) Zhao, McGill University, Canada

Tentative Program