CAVE3 Review
March 5-6, 2014
- Component Reliability
- WHTOL Accelerated Aging - 60W Equivalent LED Light Bulb
- Accelerated Failures in Cu-Al Wirebond System High Temperature Storage and Temperature-Humidity
- Diagnostic-Prognostic Sensing for Harsh In-situ Testing
- High-G Shock Testing of MEMS Devices
- Mechanical Behavior of SAC305 at High Strain Rate
- Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators
- Prognostics Health Management of LED Modules
- Reliability of MEMS Devices Under Multiple Environments
- Resistance Spectroscopy Based Assessment of Degradation in Cu-Al Interconnects
- Solid-State Lighting Life Prediction using a Bayesian Model
- Statistical Models for Leadfree Alloys to Include Aging Effects and Operating Temperature
- Thermal Cooling Options for Onboard High Power Electronics
- WHTOL Accelerated Aging - Solid-State Lighting Electrical Drivers
- Flip Chip
- Assembly of New CBGA Test Vehicle
- Characterization of Microprocessor Die Stress During Power Cycling
- Characterization of Moisture and Thermally Induced Die Stresses in Flip Chip on Laminate Assemblies
- Effect of Heat Sink Clamping on Die Stresses in Microprocessor Packages
- Effects of Moisture Exposure on Polycarbonate Materials for Electronic Packaging
- Effects of Moisture Exposure on Flip Chip Underfills
- Moisture Effects on Underfill Materials Including Preconditioning
- Connector Reliability
- Collaborative Sn Whisker Studies
- Experimental Tests and FEA Simulation of Axial Vibration Threshold of Electrical Connectors Fretting
- Observing Whisker Growth in Real Time
- The Role of Dissolved Elemental Impurities in Tin Whiskering
- Threshold of Axial Vibration Induced Fretting in Electrical Connectors
- Lead Free Soldering
- Anand Model Parameters for SACN05 Lead Free Solders
- Effects of Aging on Shear Cyclic Stress-Strain and Fatigue Behavior of Lead Free Solder Joints
- Fatigue Life of SAC205 Lead Free Solder
- FEA Modeling of 10 MM BGA Components That Include Aging Effects
- Measurements and Modeling of Fatigue Behavior of Lead Free Solders Including Aging Effects
- Nano-Mechanical Characterization of SAC Solder Joints: Effects of Aging and Silver Content
- Nano-Mechanical Characterization of SAC Solder Joints: Reduction of Aging Using Doped Alloys
- The Effects of Aging on the Anand Viscoplastic Constitutive Model for SAC305 Solder