CAVE3 Review
September 15-16, 2010
Component Reliability and Prognostic Health Management Systems
- Component Reliability and Prognostic Health Management Systems
- PCR and Ridge Regression Based Development of Norris-Landzberg Acceleration Factors and Goldmann's Constants for Lead free Electronics
- XFEM Based Models for Reliability of Electronics Under Mechanical Shock
- Prognostication Using Impedence Spectroscopy and PHM Metrics
- Kalman Filter Based Models for Prognostication of Remaining Useful Life
- Metrics Implementation in Prognostic Health Management eTool
- Join Discussion on the CAVE3 Blog
- Decision Framework for Redeployment of Electronics in Multiple Environments based on Damage Pre-Cursors
- Finite Element Models for Reliability Evaluation of NASA-MSFC Ceramic Array Micro-Coil Spring
- Board Trace Fatigue Models and Design Guidelines for Electronics Under Shock-Impact
- Package-on-Package Test Vehicle Design
- Effect of Fillet Geometry and Solder Volume on 2512 and 2010 Resistor Reliability
- Thermo-Mechanical Reliability Data of Low-Silver Leadfree Alloys
- Thermo-mechanical Reliability and Thermal Performance of HEV Metal-Matrix System
- Prediction of Transient Dynamics Interface Damage for SnAgCu Leadfree Electronics under Shock-Impact using Cohesive Zone Models
- Life-Prediction models for SnAgCu Leadfree Electronics under Shock-Impact
- Acceleration Factors and Life Prediction Models for on-chip and off-chip Failure Mechanisms
- Study of Crack Initiation and Propagation in Leadfree packages Under Multiple Thermal Environments
- Self-Organization of Failure Modes in Electronic Systems Subjected to Drop and Shock
- Thermo-mechanical Reliability Model for Component Level Solder Joints in Automotive Modules
Connectors, and System-Level Interconnects
- Connectors, and System-Level Interconnects: Degradation and Wear Mechanisms
- Sn Whiskers Formed in Electric Fields
- Whisker Thin Film Stress States Revisited
- Theoretical and Experimental Investigation of High Power Connectors for Hybrid Vehicles - A FEM Vibration Model
- Vibration Based Interfaces for Information Transmission
- The Influence of Particulate Contamination on Vibration-Induced Fretting Degradation in Electrical Connectors
- Experimental Testing and Results: 40A Automotive Connector
Flip-Chip and Underfills
- Development of Lamination Theory for STABLCOR Substrates
- Characterization and Modeling of Underfills for Microprocessor Packaging
- Effect of Heat Sink Clamping on Microprocessor Die Stress in BGA and LGA Architectures
- Characterization of Microprocessor Die Stress During Power Cycling
- In-Situ Measurement of Microprocessor Die Stress During Thermal Cycling
- Die Stress Variation in Microprocessor Packaging Subjected to Long Term Thermal Cycling
- FEA Predictions of Assembly Induced Die Stresses In Microprocessor Packaging Using Sequential Modeling Approach
- FEA Modeling of Microprocessor Packaging with Heat Sink Clamping
- Prediction of Die Stresses in Flip Chip Packaging Subjected To Temperature Variation by Finite Element Analysis
- Flip Chip on Laminate Die Stress Study
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- Aging Effects on Reliability of Leadfree Solder for Temperature Accelerated Life Testing (TV7)
- Reliability of aged lead-free solder for mechanical accelerated life testing (TV7)
- Reliability for micro BGA packages (TV8)
- Reliability of via's on Phoenix Test boards
- Thermal Performance of Laminate-to-Aluminium Attachment Materials After Cycling