CAVE3 Review
September 9-10 2009
Lead Free Soldering
- Lead Free Solder Alloys Constitutive and Wetting Behavior
- Melting Point Behavior of Mixed-Formulation Solder Alloys
- Spreading Behavior of Mixed-Formulation Solder Alloys
- Influence Of Stress Level On The Creep Strain Rate Of Solder
- The Influence of Aging Conditions on the Mechanical Behaviors of SAC Solders
- Effects of Dopants on the Creep Behavior of SAC Solders
- Modeling of Aging and Creep of Pb-Free Solders
- Microstructure Analysis of Mixed Formulation Solders and Solder Joints
- Stress-Strain and Creep Behavior of Mixed Formulation Solders
- Extreme Low Temperature Behavior of Solders
Harsh Electronics Systems and Manufacturing
- Harsh Electronics Systems and Manufacturing
- Reliability of Lead-free BGA with Leaded Paste for Harsh Environment
- Solder Joint Harsh Environmental Reliability Test on Continental GM Bending and Non-bending boards
- QFP Reliability on Powered and non-powered thermal cycle Environment
- In-Situ Environmental Testing for Solder Joint Reliability - Alternative Method (update)
- Thermal Performance of Laminate-to-Aluminum Attachment Materials After Cycling
- Measurement of Thermal Properties of an Epoxy/Alumina Composite
Flip Chip And Underfills
- Chip-Level Interconnects, Flip Chip and Underfills
- Isothermal Aging Effects on Underfill Stress-Strain Behavior
- 3Isothermal Aging Effects on Underfill Creep Behavior
- Development of Lamination Theory for STABLCOR Substrates
- Die Stress Variation in Microprocessor Packaging Subjected to Long Term Thermal Cycling
- Calculation of Die Stresses Using Different Stress-Free Reference Points
- Thermal-Mechanical Characterization of Underfills for Microprocessor Packaging
- Characterization Of A HICTE Ceramic Substrate For Microprocessor
- Comparison of Die Stresses for Different Packaging Architectures Based on Finite Element Simulation
- Determination of Stress Measurement Accuracy with Piezoresistive Sensors
- Initial Characterization of a Copper/Low-K Test Chip
- Temperature Dependent Stresses In Microprocessor Packaging
Feedback
- Component Reliability and Prognostic Health Management Systems
- Chip-Level Interconnects, Flip-Chip and Underfills
- Connectors, and System-Level Interconnects: Degradation and Wear Mechanisms
- Lead Free Solder Alloys Constitutive and Wetting Behavior
- Harsh Electronics Systems and Manufacturing
- Summary
Connector Reliability
- Connectors and System-Level Interconnects: Degradation and Wear Mechanisms
- Multiphysics/Multiscale Finite Element Model - 40 A Connector
- Experimental Investigation of High Power Connector Reliability
- Multi-Physics FEM for High Power Connectors
- Growth of Sn Whiskers on Semiconductors and Insulators
- Modeling and Analysis of a Connector System for the Prediction of Vibration-induced Fretting Degradation
- Combining Thermal and Vibrational Models to Analyze Fretting Corrosion
- Growth of Sn Whiskers in Pure O2 Environments
Component Reliability
- Component Reliability and Prognostic Health Management Systems
- Principal Component Analysis Based Development of Norris- Landzberg Acceleration Factors and Goldmann’s Constants for Lead free Electronics
- Leading Indicators based on Impedance Spectroscopy for Prognostication of Electronics under Shock and Vibration Loads
- Ramp-up of Semi-automatic Assembly Line For New-product Launch Studies
- Decision Framework for Redeployment of Electronics in Multiple Environments based on Damage Pre-Cursors
- Damage Equivalency for Assessment of Remaining Useful Life for Leadfree Electronics Subjected to Multiple Thermal Environments
- Thermo-Mechanical Models and Reliability Data for High I/O AreaArray Packages
- Thermo-mechanical Reliability of Low-Silver Leadfree Alloys
- Thermo-mechanical Reliability of Advanced Interconnects: Micro-pearl SOL, SAC305, Copper Columns
- Prediction of Transient Dynamics and Interface Damage for SnAgCu Leadfree Electronics under Shock-Impact
- Life-Prediction Models for SnAgCu Leadfree Electronics under ShockImpact
- Acceleration Factors and Life Prediction Models for on-chip and off-chip Failure Mechanisms
- Thermo-mechanical Reliability Model for DPAK and D2PAK IGBT Packages
- Anomaly Detection in Electronic Systems Subjected to Drop and Shock