Surface Mount Assembly
MPM AP Stencil Printer – Automated solder paste printing process used for printing solder paste in printed circuit boards. For INSY 6970, students are instructed about the screen printing and machine settings for high quality printing. As part of the lab, the students design an experiment to evaluate a series of variables related to the printing process.
GSI SVS 8300 3-D Solder Paste Inspection Machine – Used to evaluate the printing process to provide 3-D measurement of the printing process. This machine is automated and capability of running at high volume speeds.
Asymtek Flux Jetting System – Machine capable of automated flux dispense for advanced component placement.
Assembleon AQ-2 Pick and Place - High volume component placement machine used for placement of all components.
GSM GENESIS pick and placement machine – This machine is new equipment for high volume component pickup and placement for all components.
Viscom VPS 6053 AOI System – Visual inspection machine used for component inspection before and after reflow.
Heller 800 Reflow Oven – 10 Zone reflow oven used to reflow solder paste for the electronics manufacturing process.
SlimKIC 2000 Thermal Profiling System – Used to develop a thermal profile of the reflow process for electronics manufacturing.
Cam/Alot 3700 – Adhesive and Underfill dispense process used for component encapsulation and grid array underfills.
