College of Engineering > Academic Programs > Industrial and Systems Engineering > Research and Outreach > Laboratories > Electronics Manufacturing Laboratories > Inspection Test Equipment

Inspection Test Equipment

Phoenix X-Ray PCBA Analyzer – The machine inspect solder joints from the final assembled PCBs.

SST 3150 Static force vacuum furnace – The machine is used for die attachment during electronics packaging process.

Wire bonding machine – The machine is used for wire bonding during electronics packaging process.

CSZ and Thermotron thermal cycle chambers – The chambers are used for the reliability tests for electronics products in thermal cycle environments.

Tenney and Delta Design temperature chambers – The chambers are used for the reliability tests for electronics products in hot storage environments.