Established by R. Wayne Johnson in 1987, the Laboratory for Electronics Assembly and Packaging (LEAP) is located on the first and fourth floors of Broun Hall on the campus of Auburn University. Encompassing 3500 square feet of dedicated facilities, LEAP provides state-of-the-art electronics manufacturing, packaging, characterization, reliability testing, and failure analysis capability enabiling world-class research in electronics assembly and packaging. The Army, NASA, Air Force, NIST and industry fund projects in the Laboratory.
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