John Evans, faculty member in Auburn's Department of Industrial and Systems Engineering, and George Li, graduate student in the department, were recently recognized by the Surface Mounts Technology Association.
Evans was recognized as a luminary in "25 Highlights of SMTA History," a list compiled by SMTA's anniversary committee that highlights SMTA history and gives credit to those who helped make the organization a leading resource for technical information in the electronics assembly and advanced packaging industry. In 2003, in response to many sessions on harsh environments, Evans helped to create a conference on the topic, which has been a successful SMTA event for the past seven years. The conference has addressed topics for the automotive, industrial, military and space sectors.
Li, who is advised by Evans, received the Hutchins Grant for his project entitled "Design, Processing and Reliability Characterizations of 3-D Wafer Level Chip Scale Packaging Technology" at the SMTA International conference in October. During his tenure at Auburn, Li has been involved with several applied research programs through Auburn's Center for Advanced Vehicle and Extreme Environment Electronics (CAVE), including a printed circuit board qualification for automotive applications, reliability packaging and testing for harsh environments and module level overmolding reliability and thermal performance for automotive electronics. His doctoral research involves 3-D wafer level chip scale packaging technology that leverages the fine pitch flip chip process and high throughput, cost-effective wafer level packaging. Li received his master's in industrial and systems engineering from Auburn in 2009 and has a master's degree in electrical engineering from Shanghai Jiao Tong University in China and a bachelor's degree in electrical engineering from North China Electric Power University.